Information
485 Sihwahosu-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
+82 31-319-2440
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Overview
- Summary
- A specialized company in laser-based industrial process solutions, developing and manufacturing automated equipment essential for various industries including semiconductors, displays, mobile phones, and automotive electronics. Its role involves providing laser joining process equipment such as laser soldering, bonding, and welding, as well as laser precision processing equipment like laser texturing, etching, marking, cutting, and scribing for mass production lines. A leading enterprise in turn-key platforms for semiconductor post-processing based on ultra-precision micro-joining technology. Its capability includes delivering solutions that contribute to innovative quality and productivity improvements. A technology-oriented company creating new value based on optics, mechatronics, and process technology.A specialized company in laser-based industrial process solutions, developing and manufacturing automated equipment essential for various industries including semiconductors, displays, mobile phones, and automotive electronics. Its role involves providing laser joining process equipment such as laser soldering, bonding, and welding, as well as laser precision processing equipment like laser texturing, etching, marking, cutting, and scribing for mass production lines. A leading enterprise in turn-key platforms for semiconductor post-processing based on ultra-precision micro-joining technology. Its capability includes delivering solutions that contribute to innovative quality and productivity improvements. A technology-oriented company creating new value based on optics, mechatronics, and process technology.
- Key Products/Technologies
- Possession of integrated turn-key platform equipment based on LSMB (Laser Systemic Micro-Bonding Technology). pLSMB (Probe LSMB) is equipment for laser micro-joining probe card probes for semiconductor wafer testing, including MEMS probe card precision bonding technology, essential for high-performance memory testing. This equipment boasts high productivity and precision, capable of joining 10,000 pins per day.Possession of integrated turn-key platform equipment based on LSMB (Laser Systemic Micro-Bonding Technology). pLSMB (Probe LSMB) is equipment for laser micro-joining probe card probes for semiconductor wafer testing, including MEMS probe card precision bonding technology, essential for high-performance memory testing. This equipment boasts high productivity and precision, capable of joining 10,000 pins per day.
- sLSMB (Solder Ball LSMB) is automated solder ball joining equipment for micro-bump joining in semiconductor packaging processes. It is a core technology applied to AI and high-performance semiconductor packages such as FC-BGA, FO-WLP, and BGA. Notably, it possesses unique repair technology for precise re-embedding of micro solder balls smaller than 40 micrometers (μm), achieving world-class productivity of 50,000 bumps per hour and excellent quality stability.sLSMB (Solder Ball LSMB) is automated solder ball joining equipment for micro-bump joining in semiconductor packaging processes. It is a core technology applied to AI and high-performance semiconductor packages such as FC-BGA, FO-WLP, and BGA. Notably, it possesses unique repair technology for precise re-embedding of micro solder balls smaller than 40 micrometers (μm), achieving world-class productivity of 50,000 bumps per hour and excellent quality stability.
- dLSMB (Display LSMB) is a product line including FMM repair for displays, solar scribing, glass cutting equipment for foldable displays, and micro LED repair equipment. Its technology is also applied to the manufacturing process of perovskite solar cells, a next-generation solar cell.dLSMB (Display LSMB) is a product line including FMM repair for displays, solar scribing, glass cutting equipment for foldable displays, and micro LED repair equipment. Its technology is also applied to the manufacturing process of perovskite solar cells, a next-generation solar cell.
- Capability in developing and manufacturing laser joining process equipment such as laser soldering, bonding, and welding, as well as laser precision processing equipment like laser texturing, etching, marking, cutting, and scribing. Internalized technologies include laser beam shaping, ultra-precision stage motion control and compensation, 3D vision, and mass production automation process technology.Capability in developing and manufacturing laser joining process equipment such as laser soldering, bonding, and welding, as well as laser precision processing equipment like laser texturing, etching, marking, cutting, and scribing. Internalized technologies include laser beam shaping, ultra-precision stage motion control and compensation, 3D vision, and mass production automation process technology.
- Development and initial mass production delivery of laser joining equipment for CPO (Co-Packaged Optics), entering the core technology field for high-speed, low-latency data transmission in the AI era.Development and initial mass production delivery of laser joining equipment for CPO (Co-Packaged Optics), entering the core technology field for high-speed, low-latency data transmission in the AI era.
- Core Advantages
- Ultra-precision laser joining technology is a unique capability allowing position control at 1-2 micrometer units, one-hundredth the thickness of a human hair. The technology to precisely join tens of thousands of probe pins within a 5-micrometer error margin demonstrates world-class precision.Ultra-precision laser joining technology is a unique capability allowing position control at 1-2 micrometer units, one-hundredth the thickness of a human hair. The technology to precisely join tens of thousands of probe pins within a 5-micrometer error margin demonstrates world-class precision.
- A competitive advantage as the sole provider of turn-key solutions for essential process equipment required in front-end processes such as semiconductor testing, packaging, displays, and solar power. Particularly, its ability to integrally supply a complete set of 2D MEMS probe card manufacturing equipment.A competitive advantage as the sole provider of turn-key solutions for essential process equipment required in front-end processes such as semiconductor testing, packaging, displays, and solar power. Particularly, its ability to integrally supply a complete set of 2D MEMS probe card manufacturing equipment.
- The pLSMB equipment's productivity, which is twice as high as existing DRAM HBM semiconductor test equipment, and the sLSMB equipment's 50,000 bumps per hour production rate and excellent quality stability, significantly contribute to customers' productivity improvement and cost reduction.The pLSMB equipment's productivity, which is twice as high as existing DRAM HBM semiconductor test equipment, and the sLSMB equipment's 50,000 bumps per hour production rate and excellent quality stability, significantly contribute to customers' productivity improvement and cost reduction.
- The sLSMB's unique repair technology for precisely re-embedding micro solder balls smaller than 40 μm is a differentiating strength, enabling a breakthrough improvement in process yield that was impossible with existing equipment.The sLSMB's unique repair technology for precisely re-embedding micro solder balls smaller than 40 μm is a differentiating strength, enabling a breakthrough improvement in process yield that was impossible with existing equipment.
- Establishment of technological entry barriers in terms of process precision and productivity through core patents such as 'Probe Bonding Device and Method' and 'Soldering (Solder Ball Jetting) Device'. The precision compensation technology contributing to the localization of DRAM probe cards is a key technological advantage.Establishment of technological entry barriers in terms of process precision and productivity through core patents such as 'Probe Bonding Device and Method' and 'Soldering (Solder Ball Jetting) Device'. The precision compensation technology contributing to the localization of DRAM probe cards is a key technological advantage.
- Securing global references by being included in the supply chain of leading global AI companies and supplying laser solder bumping equipment (eLSMB) to overseas ODM companies, thereby solidifying its world-class technological competitiveness.Securing global references by being included in the supply chain of leading global AI companies and supplying laser solder bumping equipment (eLSMB) to overseas ODM companies, thereby solidifying its world-class technological competitiveness.
- Target Industrie
- Semiconductor Industry: Supply of wafer test and packaging process equipment, providing essential solutions for high-integration and miniaturization processes in advanced semiconductor fields such as HBM and FC-BGA.Semiconductor Industry: Supply of wafer test and packaging process equipment, providing essential solutions for high-integration and miniaturization processes in advanced semiconductor fields such as HBM and FC-BGA.
- Display Industry: Application of precision processing and joining process equipment, including display repair equipment and glass cutting equipment for foldable displays.Display Industry: Application of precision processing and joining process equipment, including display repair equipment and glass cutting equipment for foldable displays.
- Mobile Phone Industry: Provision of ultra-small product joining process equipment such as laser soldering, bonding, and welding for smartphone components.Mobile Phone Industry: Provision of ultra-small product joining process equipment such as laser soldering, bonding, and welding for smartphone components.
- Automotive Electronics Industry: Successful in-line integration of laser soldering for automotive electronic component manufacturing processes, known for strict quality control.Automotive Electronics Industry: Successful in-line integration of laser soldering for automotive electronic component manufacturing processes, known for strict quality control.
- Solar Industry: Possession of laser scribing facilities and optical technology related to perovskite solar cells, a next-generation solar cell.Solar Industry: Possession of laser scribing facilities and optical technology related to perovskite solar cells, a next-generation solar cell.
- Major Markets
- China, Vietnam, Japan, Taiwan, ThailandChina, Vietnam, Japan, Taiwan, Thailand
- United StatesUnited States
- Certifications/Patents
- Awarded World-Class Product certification for Laser Micro-Bonding System in 2023.Awarded World-Class Product certification for Laser Micro-Bonding System in 2023.
- Received the Jang Young-sil Award for Laser Micro-Bonding System in 2022.Received the Jang Young-sil Award for Laser Micro-Bonding System in 2022.
- Recipient of the Korea Excellent Patent Award in 2023.Recipient of the Korea Excellent Patent Award in 2023.
- Acquired confirmation as a Material, Parts, and Equipment specialized company in 2023.Acquired confirmation as a Material, Parts, and Equipment specialized company in 2023.
- CEO Nam Ki-joong received the Industrial Service Medal at the '2024 Venture Startup Promotion Merit Award'.CEO Nam Ki-joong received the Industrial Service Medal at the '2024 Venture Startup Promotion Merit Award'.
- Holds multiple core patents, including 'Probe Bonding Device and Method' and 'Soldering (Solder Ball Jetting) Device'.Holds multiple core patents, including 'Probe Bonding Device and Method' and 'Soldering (Solder Ball Jetting) Device'.
- Possesses core patents for precision compensation technology, establishing a technological entry barrier.Possesses core patents for precision compensation technology, establishing a technological entry barrier.
- Operates an affiliated research institute, continuously striving for laser technology research, development, and product commercialization.Operates an affiliated research institute, continuously striving for laser technology research, development, and product commercialization.
Introduction
Location
485 Sihwahosu-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
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