Information
162 Seungnyang-gil, Wongok-myeon, Anseong-si, Gyeonggi-do, South Korea
+82 31-654-9229
-
-
Overview
- Summary
- C&G HITECH is a technology-specialized company developing and supplying Central Chemical Supply Systems (CCSS) essential for semiconductor and display manufacturing processes. The company holds unique competitiveness in chemical mixing equipment based on ultra-precision flow control and mixing technology. Building upon its stable CCSS business, it is expanding its portfolio into high-value-added advanced materials such as glass substrates, low-dielectric FCCL, and heat dissipation substrates. It is also pursuing sustainable growth by venturing into eco-friendly material businesses through carbon capture and utilization technologies. Established in 2002, the company was listed on the KOSDAQ market in 2018.C&G HITECH is a technology-specialized company developing and supplying Central Chemical Supply Systems (CCSS) essential for semiconductor and display manufacturing processes. The company holds unique competitiveness in chemical mixing equipment based on ultra-precision flow control and mixing technology. Building upon its stable CCSS business, it is expanding its portfolio into high-value-added advanced materials such as glass substrates, low-dielectric FCCL, and heat dissipation substrates. It is also pursuing sustainable growth by venturing into eco-friendly material businesses through carbon capture and utilization technologies. Established in 2002, the company was listed on the KOSDAQ market in 2018.
- Key Products/Technologies
- CCSS (Central Chemical Supply System): An automated system for supplying high-purity chemicals required in semiconductor and display manufacturing processes to final mass production facilities. It comprises chemical mixing, supply, and recycling units, with particular expertise in precise concentration control down to ppb levels. Models include DSP+, SC-1, developer mixing, ammonia water mixing, and hydrofluoric acid mixing.CCSS (Central Chemical Supply System): An automated system for supplying high-purity chemicals required in semiconductor and display manufacturing processes to final mass production facilities. It comprises chemical mixing, supply, and recycling units, with particular expertise in precise concentration control down to ppb levels. Models include DSP+, SC-1, developer mixing, ammonia water mixing, and hydrofluoric acid mixing.
- DPF (Developer Purification Filtering) and DDS-11 (Developer Management System): Equipment for purifying and filtering developer solutions for reuse in lithography processes, and a system for analyzing and maintaining consistent developer concentration.DPF (Developer Purification Filtering) and DDS-11 (Developer Management System): Equipment for purifying and filtering developer solutions for reuse in lithography processes, and a system for analyzing and maintaining consistent developer concentration.
- Glass Substrate: High-precision, high-integration, high-performance substrate technology achieved through excellent metallization of Glass/Metal Layers and TGV (Through-Glass-Via) filling. Proprietary surface treatment technology ensures adhesion of 7N/cm or more between glass and copper, with void-free copper deposition/plating in holes up to an aspect ratio of 1:5.Glass Substrate: High-precision, high-integration, high-performance substrate technology achieved through excellent metallization of Glass/Metal Layers and TGV (Through-Glass-Via) filling. Proprietary surface treatment technology ensures adhesion of 7N/cm or more between glass and copper, with void-free copper deposition/plating in holes up to an aspect ratio of 1:5.
- Heat Dissipation Substrate: High thermal conductivity substrate utilizing Cu/AlN composite technology, characterized by metal-level thermal conductivity, high cost-effectiveness, and low initial investment. Plasma ion beam surface treatment technology enhances adhesion between dissimilar materials by modifying ceramic surfaces.Heat Dissipation Substrate: High thermal conductivity substrate utilizing Cu/AlN composite technology, characterized by metal-level thermal conductivity, high cost-effectiveness, and low initial investment. Plasma ion beam surface treatment technology enhances adhesion between dissimilar materials by modifying ceramic surfaces.
- Low Dielectric FCCL (Flexible Copper Clad Laminate): Flexible copper clad laminate addressing the demand for high-frequency and high-response technologies in 5G/6G communication and autonomous driving sensors. Features low dielectric constant, low signal loss, excellent heat resistance, and low moisture absorption at frequencies above 30GHz.Low Dielectric FCCL (Flexible Copper Clad Laminate): Flexible copper clad laminate addressing the demand for high-frequency and high-response technologies in 5G/6G communication and autonomous driving sensors. Features low dielectric constant, low signal loss, excellent heat resistance, and low moisture absorption at frequencies above 30GHz.
- Carbon Fusion Materials (FCM): Conductive carbon-based fillers fused with polymers, offering lighter weight and enhanced corrosion resistance compared to metals. Manufactured in pellet form, allowing for versatile product and component fabrication.Carbon Fusion Materials (FCM): Conductive carbon-based fillers fused with polymers, offering lighter weight and enhanced corrosion resistance compared to metals. Manufactured in pellet form, allowing for versatile product and component fabrication.
- Lining Sheets: Special sheets for protecting the inner surfaces of chemical storage tanks and piping from harsh chemicals. The company exclusively imports and supplies APV sheets through collaboration with Daikin of Japan.Lining Sheets: Special sheets for protecting the inner surfaces of chemical storage tanks and piping from harsh chemicals. The company exclusively imports and supplies APV sheets through collaboration with Daikin of Japan.
- Etching Gas Localization: Pursuit of high-purity fluorochemical dry etching gas localization through investment in a joint venture (Daikin Advanced Materials Korea) with Daikin Industries of Japan and Samsung C&T.Etching Gas Localization: Pursuit of high-purity fluorochemical dry etching gas localization through investment in a joint venture (Daikin Advanced Materials Korea) with Daikin Industries of Japan and Samsung C&T.
- Baking Soda Manufacturing: As part of its eco-friendly material business, the development of baking soda manufacturing technology based on carbon capture and utilization (CCU) for exhaust gas purification and wastewater neutralization.Baking Soda Manufacturing: As part of its eco-friendly material business, the development of baking soda manufacturing technology based on carbon capture and utilization (CCU) for exhaust gas purification and wastewater neutralization.
- Core Advantages
- Ultra-precision Chemical Mixing Technology: A domestic pioneer in ultra-precision central chemical supply systems, with unique expertise in chemical mixing equipment capable of precise concentration control down to ppb (parts per billion) levels.Ultra-precision Chemical Mixing Technology: A domestic pioneer in ultra-precision central chemical supply systems, with unique expertise in chemical mixing equipment capable of precise concentration control down to ppb (parts per billion) levels.
- Strong Partnerships with Global Clients: Securing key clients including major domestic and international semiconductor companies like Samsung Electronics and SK Hynix, and display manufacturers such as Samsung Display, LG Display, BOE.Strong Partnerships with Global Clients: Securing key clients including major domestic and international semiconductor companies like Samsung Electronics and SK Hynix, and display manufacturers such as Samsung Display, LG Display, BOE.
- Diversified Portfolio into Advanced Materials and Eco-friendly Businesses: Expanding beyond its core CCSS equipment business into high-value-added advanced electronic materials like glass substrates, heat dissipation substrates, and low-dielectric FCCL, as well as eco-friendly sectors such as carbon capture and baking soda manufacturing, securing future growth engines.Diversified Portfolio into Advanced Materials and Eco-friendly Businesses: Expanding beyond its core CCSS equipment business into high-value-added advanced electronic materials like glass substrates, heat dissipation substrates, and low-dielectric FCCL, as well as eco-friendly sectors such as carbon capture and baking soda manufacturing, securing future growth engines.
- Proprietary Innovative Glass Substrate Technology: Addressing critical challenges in glass substrates, including achieving stable adhesion between glass and copper electrodes and void-free deposition in TGVs, positioning the company as a leader in next-generation packaging technology for AI and High-Performance Computing (HPC) markets.Proprietary Innovative Glass Substrate Technology: Addressing critical challenges in glass substrates, including achieving stable adhesion between glass and copper electrodes and void-free deposition in TGVs, positioning the company as a leader in next-generation packaging technology for AI and High-Performance Computing (HPC) markets.
- Strategic Technology Alliances and Exclusive Supply Chains: Demonstrating overseas export of display equipment through strategic collaborations with Japanese companies like Nagase and Daikin, and establishing a stable supply chain by exclusively importing specialized lining sheets (APV sheets).Strategic Technology Alliances and Exclusive Supply Chains: Demonstrating overseas export of display equipment through strategic collaborations with Japanese companies like Nagase and Daikin, and establishing a stable supply chain by exclusively importing specialized lining sheets (APV sheets).
- Proactive Investment for Production Capacity Expansion: Preparing for long-term growth by constructing new factories in Anseong Technovalley to more than double CCSS production capacity and establish infrastructure for mass production of new material businesses.Proactive Investment for Production Capacity Expansion: Preparing for long-term growth by constructing new factories in Anseong Technovalley to more than double CCSS production capacity and establish infrastructure for mass production of new material businesses.
- Target Industries
- Semiconductor Industry: Central Chemical Supply Systems (CCSS), glass substrates, low-dielectric FCCL, etching gas localization, etc.Semiconductor Industry: Central Chemical Supply Systems (CCSS), glass substrates, low-dielectric FCCL, etching gas localization, etc.
- Display Industry: Central Chemical Supply Systems (CCSS), developer purification and management systems, glass substrates, low-dielectric FCCL, etc.Display Industry: Central Chemical Supply Systems (CCSS), developer purification and management systems, glass substrates, low-dielectric FCCL, etc.
- Electric and Hybrid Electric Vehicle (EV/HEV) Industry: Heat dissipation substrates for powertrains.Electric and Hybrid Electric Vehicle (EV/HEV) Industry: Heat dissipation substrates for powertrains.
- Advanced IT Device Industry: Heat dissipation substrates, low-dielectric FCCL, and glass substrates for power semiconductors and High-Performance Computing (HPC) in mobile phones, digital electronic devices, and LED modules.Advanced IT Device Industry: Heat dissipation substrates, low-dielectric FCCL, and glass substrates for power semiconductors and High-Performance Computing (HPC) in mobile phones, digital electronic devices, and LED modules.
- 5G/6G Communication Industry: Low-dielectric FCCL for ultra-high frequency wireless communication.5G/6G Communication Industry: Low-dielectric FCCL for ultra-high frequency wireless communication.
- AI Industry: Glass substrates for AI semiconductors and PCB packaging materials.AI Industry: Glass substrates for AI semiconductors and PCB packaging materials.
- Chemical Industry: Lining sheets for chemical storage tanks.Chemical Industry: Lining sheets for chemical storage tanks.
- Environmental Industry: Baking soda manufacturing based on Carbon Capture and Utilization (CCU) technology.Environmental Industry: Baking soda manufacturing based on Carbon Capture and Utilization (CCU) technology.
- Major Markets
- China, Japan, Taiwan, South Korea (domestic)China, Japan, Taiwan, South Korea (domestic)
- USAUSA
- Certifications/Patents
- Holds a total of 71 patents (as of 2024).Holds a total of 71 patents (as of 2024).
- ISO 9001 / 14001 Certification (2004).ISO 9001 / 14001 Certification (2004).
- Venture Company Certification (2003).Venture Company Certification (2003).
- Enterprise Affiliated Research Institute Certification (2003).Enterprise Affiliated Research Institute Certification (2003).
- Selected as a Promising Small and Medium-sized Enterprise by Gyeonggi Province (2004).Selected as a Promising Small and Medium-sized Enterprise by Gyeonggi Province (2004).
- Inno-Biz (Technology Innovation Type Small and Medium Business) Certification (2006).Inno-Biz (Technology Innovation Type Small and Medium Business) Certification (2006).
- Management Innovation Type Small and Medium Business Certification (2006).Management Innovation Type Small and Medium Business Certification (2006).
- Awarded the '5 Million Dollar Export Tower' (2007).Awarded the '5 Million Dollar Export Tower' (2007).
- Selected as a 'Youth-Friendly Small Giant' by the Ministry of Employment and Labor (2019).Selected as a 'Youth-Friendly Small Giant' by the Ministry of Employment and Labor (2019).
- Awarded the Grand Prize for 'Best Small and Medium Business (Corporate Culture)' at the 3rd 'Great Workplace' awards (2020).Awarded the Grand Prize for 'Best Small and Medium Business (Corporate Culture)' at the 3rd 'Great Workplace' awards (2020).
- Recognized as one of Forbes Asia's 'Top 200 Promising Small and Medium-sized Companies' (2022).Recognized as one of Forbes Asia's 'Top 200 Promising Small and Medium-sized Companies' (2022).
- Patents filed for core glass substrate technologies: enhanced glass-copper adhesion through proprietary surface treatment and void-free copper deposition/plating in TGVs.Patents filed for core glass substrate technologies: enhanced glass-copper adhesion through proprietary surface treatment and void-free copper deposition/plating in TGVs.
Introduction
Location
162 Seungnyang-gil, Wongok-myeon, Anseong-si, Gyeonggi-do, South Korea
클릭하여 위치 살펴보기
