BNF MATERIALS, The Republic of Korea - Komachine Supplier Profile and Product List

- BNF Materials Co., Ltd. is a specialized company in the development and production of core electronic component joining materials for future IT devices and network infrastructure. The company possesses specialized technology in eco-friendly solder products, including lead-free solder paste, solder bar, and solder wire. It stands as a leading enterprise with the unique capability of manufacturing the entire solder paste process in Korea.BNF Materials Co., Ltd. is a specialized company in the development and production of core electronic component joining materials for future IT devices and network infrastructure. The company possesses specialized technology in eco-friendly solder products, including lead-free solder paste, solder bar, and solder wire. It stands as a leading enterprise with the unique capability of manufacturing the entire solder paste process in Korea.
- The main product categories include solder paste, solder powder, solder bar, solder wire, and preform chip solder.The main product categories include solder paste, solder powder, solder bar, solder wire, and preform chip solder.
- Solder paste offerings comprise Sn-Ag-Cu based SAC305 (models LST309M-K21, LST309M, LST305-T5K22), Halogen Free Solder Paste (model LST305-ER (HF)), Sn-Ag-Cu based SAC105 (model LST105 (Low AG Based)), Low Temperature solder (model LST 57-A), and the LFA Series, presenting a diverse product lineup.Solder paste offerings comprise Sn-Ag-Cu based SAC305 (models LST309M-K21, LST309M, LST305-T5K22), Halogen Free Solder Paste (model LST305-ER (HF)), Sn-Ag-Cu based SAC105 (model LST105 (Low AG Based)), Low Temperature solder (model LST 57-A), and the LFA Series, presenting a diverse product lineup.
- Solder powder is supplied in various fine particle sizes such as T4 (20-38㎛), T5 (15-25㎛), T6 (5-15㎛), and T7 (2-11㎛), applicable for chips like 1005, 0603/0402, and 0201.Solder powder is supplied in various fine particle sizes such as T4 (20-38㎛), T5 (15-25㎛), T6 (5-15㎛), and T7 (2-11㎛), applicable for chips like 1005, 0603/0402, and 0201.
- Solder bars include both lead-free and Sn-Pb solders, featuring various tin contents and melting points such as Sn95, Sn65, and Sn63.Solder bars include both lead-free and Sn-Pb solders, featuring various tin contents and melting points such as Sn95, Sn65, and Sn63.
- The company focuses on low-temperature solder technology development, aiming for mass production application of Bi-based next-generation low-temperature solder (Gen4 LTS) by 2025.The company focuses on low-temperature solder technology development, aiming for mass production application of Bi-based next-generation low-temperature solder (Gen4 LTS) by 2025.
- Continuous R&D activities through its own research institute ensure the development of eco-friendly and high-performance materials.Continuous R&D activities through its own research institute ensure the development of eco-friendly and high-performance materials.
- Unique competitive edge in Korea with proprietary technology and facilities for the entire manufacturing process of solder paste.Unique competitive edge in Korea with proprietary technology and facilities for the entire manufacturing process of solder paste.
- Acquisition of multiple patented technologies for the production and supply of lead-free solder products, establishing a leading position in eco-friendly materials.Acquisition of multiple patented technologies for the production and supply of lead-free solder products, establishing a leading position in eco-friendly materials.
- Provision of a comprehensive solution capability through a wide range of electronic component joining materials, including solder paste, powder, bar, wire, and preform chip solder.Provision of a comprehensive solution capability through a wide range of electronic component joining materials, including solder paste, powder, bar, wire, and preform chip solder.
- Strong future market responsiveness through focused R&D on customer-centric and eco-friendly materials, particularly in the development of Bi-based next-generation low-temperature solder technology.Strong future market responsiveness through focused R&D on customer-centric and eco-friendly materials, particularly in the development of Bi-based next-generation low-temperature solder technology.
- Ensured product reliability and environmental friendliness through ISO 9001 and ISO 14001 quality and environmental management system certifications.Ensured product reliability and environmental friendliness through ISO 9001 and ISO 14001 quality and environmental management system certifications.
- A rigorous quality control and technical verification system utilizing advanced analytical equipment such as particle size analyzers, viscometers, and SEM analyzers.A rigorous quality control and technical verification system utilizing advanced analytical equipment such as particle size analyzers, viscometers, and SEM analyzers.
- Demonstrated global market competitiveness and export capabilities, evidenced by the award of the 'Ten Million Dollar Export Tower' on the 52nd Trade Day.Demonstrated global market competitiveness and export capabilities, evidenced by the award of the 'Ten Million Dollar Export Tower' on the 52nd Trade Day.
- Advanced electronic component joining in the semiconductor industry.Advanced electronic component joining in the semiconductor industry.
- Electronic component joining in the automotive industry.Electronic component joining in the automotive industry.
- Electronic component joining in the display industry.Electronic component joining in the display industry.
- Electronic component joining in the solar power industry.Electronic component joining in the solar power industry.
- Manufacturing of future IT devices and construction of related network systems.Manufacturing of future IT devices and construction of related network systems.
- Research and development of joining materials for the aerospace industry as a future goal.Research and development of joining materials for the aerospace industry as a future goal.
- VietnamVietnam
- Possession of multiple patented technologies for the production and supply of lead-free solder products.Possession of multiple patented technologies for the production and supply of lead-free solder products.
- Acquisition of patents for lead-free alloy systems and proprietary core technologies.Acquisition of patents for lead-free alloy systems and proprietary core technologies.
- ISO 9001 Quality Management System certification.ISO 9001 Quality Management System certification.
- ISO 14001 Environmental Management System certification.ISO 14001 Environmental Management System certification.
- Selection as a Root Company by the National Root Industry Promotion Center in 2019.Selection as a Root Company by the National Root Industry Promotion Center in 2019.
- Designation as a specialized material and component company by the Ministry of Trade, Industry and Energy in 2016.Designation as a specialized material and component company by the Ministry of Trade, Industry and Energy in 2016.
- Selection as an INNO-BIZ (Technology Innovation Small and Medium Business) in 2009.Selection as an INNO-BIZ (Technology Innovation Small and Medium Business) in 2009.