BNF Materials Co., Ltd. is a specialized company in the development and production of core electronic component joining materials for future IT devices and network infrastructure. The company possesses specialized technology in eco-friendly solder products, including lead-free solder paste, solder bar, and solder wire. It stands as a leading enterprise with the unique capability of manufacturing the entire solder paste process in Korea.BNFMaterialsCo.,Ltd.isaspecializedcompanyinthedevelopmentandproductionofcoreelectroniccomponentjoiningmaterialsforfutureITdevicesandnetworkinfrastructure.Thecompanypossessesspecializedtechnologyineco-friendlysolderproducts,includinglead-freesolderpaste,solderbar,andsolderwire.ItstandsasaleadingenterprisewiththeuniquecapabilityofmanufacturingtheentiresolderpasteprocessinKorea.
Key Products/TechnologiesKeyProducts/Technologies
The main product categories include solder paste, solder powder, solder bar, solder wire, and preform chip solder.Themainproductcategoriesincludesolderpaste,solderpowder,solderbar,solderwire,andpreformchipsolder.
Solder paste offerings comprise Sn-Ag-Cu based SAC305 (models LST309M-K21, LST309M, LST305-T5K22), Halogen Free Solder Paste (model LST305-ER (HF)), Sn-Ag-Cu based SAC105 (model LST105 (Low AG Based)), Low Temperature solder (model LST 57-A), and the LFA Series, presenting a diverse product lineup.SolderpasteofferingscompriseSn-Ag-CubasedSAC305(modelsLST309M-K21,LST309M,LST305-T5K22),HalogenFreeSolderPaste(modelLST305-ER(HF)),Sn-Ag-CubasedSAC105(modelLST105(LowAGBased)),LowTemperaturesolder(modelLST57-A),andtheLFASeries,presentingadiverseproductlineup.
Solder powder is supplied in various fine particle sizes such as T4 (20-38㎛), T5 (15-25㎛), T6 (5-15㎛), and T7 (2-11㎛), applicable for chips like 1005, 0603/0402, and 0201.SolderpowderissuppliedinvariousfineparticlesizessuchasT4(20-38㎛),T5(15-25㎛),T6(5-15㎛),andT7(2-11㎛),applicableforchipslike1005,0603/0402,and0201.
Solder bars include both lead-free and Sn-Pb solders, featuring various tin contents and melting points such as Sn95, Sn65, and Sn63.Solderbarsincludebothlead-freeandSn-Pbsolders,featuringvarioustincontentsandmeltingpointssuchasSn95,Sn65,andSn63.
The company focuses on low-temperature solder technology development, aiming for mass production application of Bi-based next-generation low-temperature solder (Gen4 LTS) by 2025.Thecompanyfocusesonlow-temperaturesoldertechnologydevelopment,aimingformassproductionapplicationofBi-basednext-generationlow-temperaturesolder(Gen4LTS)by2025.
Continuous R&D activities through its own research institute ensure the development of eco-friendly and high-performance materials.ContinuousR&Dactivitiesthroughitsownresearchinstituteensurethedevelopmentofeco-friendlyandhigh-performancematerials.
Core AdvantagesCoreAdvantages
Unique competitive edge in Korea with proprietary technology and facilities for the entire manufacturing process of solder paste.UniquecompetitiveedgeinKoreawithproprietarytechnologyandfacilitiesfortheentiremanufacturingprocessofsolderpaste.
Acquisition of multiple patented technologies for the production and supply of lead-free solder products, establishing a leading position in eco-friendly materials.Acquisitionofmultiplepatentedtechnologiesfortheproductionandsupplyoflead-freesolderproducts,establishingaleadingpositionineco-friendlymaterials.
Provision of a comprehensive solution capability through a wide range of electronic component joining materials, including solder paste, powder, bar, wire, and preform chip solder.Provisionofacomprehensivesolutioncapabilitythroughawiderangeofelectroniccomponentjoiningmaterials,includingsolderpaste,powder,bar,wire,andpreformchipsolder.
Strong future market responsiveness through focused R&D on customer-centric and eco-friendly materials, particularly in the development of Bi-based next-generation low-temperature solder technology.StrongfuturemarketresponsivenessthroughfocusedR&Doncustomer-centricandeco-friendlymaterials,particularlyinthedevelopmentofBi-basednext-generationlow-temperaturesoldertechnology.
Ensured product reliability and environmental friendliness through ISO 9001 and ISO 14001 quality and environmental management system certifications.EnsuredproductreliabilityandenvironmentalfriendlinessthroughISO9001andISO14001qualityandenvironmentalmanagementsystemcertifications.
A rigorous quality control and technical verification system utilizing advanced analytical equipment such as particle size analyzers, viscometers, and SEM analyzers.Arigorousqualitycontrolandtechnicalverificationsystemutilizingadvancedanalyticalequipmentsuchasparticlesizeanalyzers,viscometers,andSEManalyzers.
Demonstrated global market competitiveness and export capabilities, evidenced by the award of the 'Ten Million Dollar Export Tower' on the 52nd Trade Day.Demonstratedglobalmarketcompetitivenessandexportcapabilities,evidencedbytheawardofthe'TenMillionDollarExportTower'onthe52ndTradeDay.
Target IndustrieTargetIndustrie
Advanced electronic component joining in the semiconductor industry.Advancedelectroniccomponentjoininginthesemiconductorindustry.
Electronic component joining in the automotive industry.Electroniccomponentjoiningintheautomotiveindustry.
Electronic component joining in the display industry.Electroniccomponentjoininginthedisplayindustry.
Electronic component joining in the solar power industry.Electroniccomponentjoininginthesolarpowerindustry.
Manufacturing of future IT devices and construction of related network systems.ManufacturingoffutureITdevicesandconstructionofrelatednetworksystems.
Research and development of joining materials for the aerospace industry as a future goal.Researchanddevelopmentofjoiningmaterialsfortheaerospaceindustryasafuturegoal.
Major MarketsMajorMarkets
VietnamVietnam
Certifications/PatentsCertifications/Patents
Possession of multiple patented technologies for the production and supply of lead-free solder products.Possessionofmultiplepatentedtechnologiesfortheproductionandsupplyoflead-freesolderproducts.
Acquisition of patents for lead-free alloy systems and proprietary core technologies.Acquisitionofpatentsforlead-freealloysystemsandproprietarycoretechnologies.
ISO 9001 Quality Management System certification.ISO9001QualityManagementSystemcertification.
ISO 14001 Environmental Management System certification.ISO14001EnvironmentalManagementSystemcertification.
Selection as a Root Company by the National Root Industry Promotion Center in 2019.SelectionasaRootCompanybytheNationalRootIndustryPromotionCenterin2019.
Designation as a specialized material and component company by the Ministry of Trade, Industry and Energy in 2016.DesignationasaspecializedmaterialandcomponentcompanybytheMinistryofTrade,IndustryandEnergyin2016.
Selection as an INNO-BIZ (Technology Innovation Small and Medium Business) in 2009.SelectionasanINNO-BIZ(TechnologyInnovationSmallandMediumBusiness)in2009.