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Flip Chip Bonding System
Model Name
FCB-120L
Series
Semiconductor
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Data
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AP-Tech

Semi conductor equipment manufacturer, WLP, CSP, COG, Camera Module and more

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Manufacturer
AP-Tech
Product Type
Machine
Brand
-
SKU
53651
Product Name
Flip Chip Bonding System
Model Name
FCB-120L
Size
-
Weight
-
Product Details

AP-Tech Flip Chip Bonding System FCB-120L

AP-Tech Flip Chip Bonding System FCB-120L 1



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AP-Tech
AP-Tech
Semi conductor equipment manufacturer, WLP, CSP, COG, Camera Module and more
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Komachine Inc.
CEOCharlie Park
Corporate #535-86-00664
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
112, Garage L145, B1,
Saenggakgongjang, 150, Yeongdeungpo-ro, Yeongdeungpo-gu, Seoul, Republic of Korea 07292
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