ALT Co., Ltd. is a specialized post-process semiconductor test company, offering wafer and final test services for high-difficulty products such as SoC, DDI, and CIS. The company provides total test solutions to customers, including test program development, and incorporates an AVI (Auto Visual Inspection) process for optimal productivity and product quality. Furthermore, it possesses the capability to provide cold test environments using Chiller equipment, addressing diverse customer requirements. Recently, the company is exploring entry into the next-generation power semiconductor market through the development and patent application of SiC (Silicon Carbide) wafer post-processing technology.ALTCo.,Ltd.isaspecializedpost-processsemiconductortestcompany,offeringwaferandfinaltestservicesforhigh-difficultyproductssuchasSoC,DDI,andCIS.Thecompanyprovidestotaltestsolutionstocustomers,includingtestprogramdevelopment,andincorporatesanAVI(AutoVisualInspection)processforoptimalproductivityandproductquality.Furthermore,itpossessesthecapabilitytoprovidecoldtestenvironmentsusingChillerequipment,addressingdiversecustomerrequirements.Recently,thecompanyisexploringentryintothenext-generationpowersemiconductormarketthroughthedevelopmentandpatentapplicationofSiC(SiliconCarbide)waferpost-processingtechnology.
Key Products/TechnologiesKeyProducts/Technologies
SoC Test: Provision of wafer test services for SoC products primarily used in mobile devices and embedded systems, with test solutions aimed at maintaining high performance and minimizing power consumption.SoCTest:ProvisionofwafertestservicesforSoCproductsprimarilyusedinmobiledevicesandembeddedsystems,withtestsolutionsaimedatmaintaininghighperformanceandminimizingpowerconsumption.
DDI Test: Offering probe and final test services for Display Driver ICs (DDI), including visual inspection, based on long-term partnerships with global fabless companies and integrated device manufacturers.DDITest:OfferingprobeandfinaltestservicesforDisplayDriverICs(DDI),includingvisualinspection,basedonlong-termpartnershipswithglobalfablesscompaniesandintegrateddevicemanufacturers.
CIS Test: Provision of EDS (Electrical Die Sorting) test solutions for CMOS Image Sensors (CIS), specializing in testing image sensors that convert light into electrical signals for digital data.CISTest:ProvisionofEDS(ElectricalDieSorting)testsolutionsforCMOSImageSensors(CIS),specializingintestingimagesensorsthatconvertlightintoelectricalsignalsfordigitaldata.
PMIC Test: Offering probe test services for Power Management ICs (PMIC) and other sensor products.PMICTest:OfferingprobetestservicesforPowerManagementICs(PMIC)andothersensorproducts.
Memory Controller Test: Provision of memory controller test services, with business expansion into the eSSD memory controller test market for data centers.MemoryControllerTest:Provisionofmemorycontrollertestservices,withbusinessexpansionintotheeSSDmemorycontrollertestmarketfordatacenters.
Wafer Test: Capable of 6-inch, 8-inch, and 12-inch SoC wafer testing, providing comprehensive test services including test program development.WaferTest:Capableof6-inch,8-inch,and12-inchSoCwafertesting,providingcomprehensivetestservicesincludingtestprogramdevelopment.
RECON & COG: Possessing reconstruct technology for rearranging good dies and preparatory technology for COG (Chip on Glass) process operations.RECON&COG:PossessingreconstructtechnologyforrearranginggooddiesandpreparatorytechnologyforCOG(ChiponGlass)processoperations.
RIM (RING) CUT: Holding Rim-Cut process technology for removing the edges of ultra-thin wafers, a unique domestic technology with patent applications and commercialization underway for SiC wafer post-processing.RIM(RING)CUT:HoldingRim-Cutprocesstechnologyforremovingtheedgesofultra-thinwafers,auniquedomestictechnologywithpatentapplicationsandcommercializationunderwayforSiCwaferpost-processing.
Core AdvantagesCoreAdvantages
Diversification of Test Items: Securing differentiated competitive advantage within the industry through the diversification of non-memory semiconductor test items such as DDI, CIS, PMIC, SoC, and Memory Controller.DiversificationofTestItems:Securingdifferentiatedcompetitiveadvantagewithintheindustrythroughthediversificationofnon-memorysemiconductortestitemssuchasDDI,CIS,PMIC,SoC,andMemoryController.
Total Test Service Provision Capability: Comprehensive test service capabilities encompassing test program development, wafer testing, cold test environments using Chiller equipment, and AVI (Auto Visual Inspection) processes.TotalTestServiceProvisionCapability:Comprehensivetestservicecapabilitiesencompassingtestprogramdevelopment,wafertesting,coldtestenvironmentsusingChillerequipment,andAVI(AutoVisualInspection)processes.
Expertise in High-Difficulty Product Testing: Possession of specialized testing know-how for high-difficulty non-memory semiconductor products, including Display Driver ICs, CMOS Image Sensors, and Power Management ICs.ExpertiseinHigh-DifficultyProductTesting:Possessionofspecializedtestingknow-howforhigh-difficultynon-memorysemiconductorproducts,includingDisplayDriverICs,CMOSImageSensors,andPowerManagementICs.
Proactive Next-Generation Technology Adoption: Pursuing the development and commercialization of SiC wafer post-processing technology based on its unique domestic Rim-Cut technology, securing future growth engines such as the electric vehicle power semiconductor market.ProactiveNext-GenerationTechnologyAdoption:PursuingthedevelopmentandcommercializationofSiCwaferpost-processingtechnologybasedonitsuniquedomesticRim-Cuttechnology,securingfuturegrowthenginessuchastheelectricvehiclepowersemiconductormarket.
High Wafer Yield Management Technology: Uniquely possessing wafer yield management technology of over 90% in Korea, providing a strong advantage in efficient yield management and test solutions during the semiconductor wafer manufacturing stage.HighWaferYieldManagementTechnology:Uniquelypossessingwaferyieldmanagementtechnologyofover90%inKorea,providingastrongadvantageinefficientyieldmanagementandtestsolutionsduringthesemiconductorwafermanufacturingstage.
Diversification of Front-End Markets: Actively pursuing business diversification from a mobile-centric revenue structure to high-growth front-end markets, such as eSSD memory controller testing for data centers.DiversificationofFront-EndMarkets:Activelypursuingbusinessdiversificationfromamobile-centricrevenuestructuretohigh-growthfront-endmarkets,suchaseSSDmemorycontrollertestingfordatacenters.
Target IndustrieTargetIndustrie
Mobile Device Industry: Support for semiconductors in smartphones, tablets, and other mobile devices through SoC and DDI testing.MobileDeviceIndustry:Supportforsemiconductorsinsmartphones,tablets,andothermobiledevicesthroughSoCandDDItesting.
Display Industry: Contribution to TV, monitor, and smart device display sectors through Display Driver IC (DDI) testing.DisplayIndustry:ContributiontoTV,monitor,andsmartdevicedisplaysectorsthroughDisplayDriverIC(DDI)testing.
Automotive Electronics Industry: Entry into the automotive electronics component market through CMOS Image Sensor (CCTV, automotive image sensors) packaging and SiC power semiconductor post-processing technology.AutomotiveElectronicsIndustry:EntryintotheautomotiveelectronicscomponentmarketthroughCMOSImageSensor(CCTV,automotiveimagesensors)packagingandSiCpowersemiconductorpost-processingtechnology.
Embedded Systems Industry: Provision of test solutions for SoC products applied in various embedded systems.EmbeddedSystemsIndustry:ProvisionoftestsolutionsforSoCproductsappliedinvariousembeddedsystems.
Data Center Industry: Support for high-performance computing and storage sectors through eSSD memory controller testing for data centers.DataCenterIndustry:Supportforhigh-performancecomputingandstoragesectorsthrougheSSDmemorycontrollertestingfordatacenters.
Industrial Power Management: Contribution to improving power management efficiency in industrial equipment and systems through PMIC and MCU testing.IndustrialPowerManagement:ContributiontoimprovingpowermanagementefficiencyinindustrialequipmentandsystemsthroughPMICandMCUtesting.
Major MarketsMajorMarkets
South Korea, China, Taiwan, MalaysiaSouthKorea,China,Taiwan,Malaysia
United StatesUnitedStates
Certifications/PatentsCertifications/Patents
Patent Application for SiC Wafer Post-Processing: Filed patent applications related to SiC wafers, a key material for next-generation power semiconductors, based on its unique domestic Rim-Cut technology.PatentApplicationforSiCWaferPost-Processing:FiledpatentapplicationsrelatedtoSiCwafers,akeymaterialfornext-generationpowersemiconductors,basedonitsuniquedomesticRim-Cuttechnology.
ESG Management Certification: Acquired ESG management certification in November 2023, demonstrating efforts towards sustainable management and social responsibility.ESGManagementCertification:AcquiredESGmanagementcertificationinNovember2023,demonstratingeffortstowardssustainablemanagementandsocialresponsibility.
Quality and Environmental Policies: Explicitly states quality policy, environmental policy, conflict minerals policy, and code of conduct on its official website, emphasizing corporate social responsibility and ethical management.QualityandEnvironmentalPolicies:Explicitlystatesqualitypolicy,environmentalpolicy,conflictmineralspolicy,andcodeofconductonitsofficialwebsite,emphasizingcorporatesocialresponsibilityandethicalmanagement.
R&D and Patents Sections: Operates dedicated R&D and Patents sections on its official website, indicating a strong commitment to technological development and intellectual property rights.R&DandPatentsSections:OperatesdedicatedR&DandPatentssectionsonitsofficialwebsite,indicatingastrongcommitmenttotechnologicaldevelopmentandintellectualpropertyrights.
Introduction
Location
82-19 Gwahaksaneop 1-ro, Oksan-myeon, Heungdeok-gu, Cheongju, Chungcheongbuk-do, South Korea
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82-19 Gwahaksaneop 1-ro, Oksan-myeon, Heungdeok-gu, Cheongju, Chungcheongbuk-do, South Korea