AEM is a leading supplier of high-reliability fuses, ferrite chip beads, and other electronic components for mission-critical applications in space, aerospace, defense, automotive, and industrial sectors.AEMisaleadingsupplierofhigh-reliabilityfuses,ferritechipbeads,andotherelectroniccomponentsformission-criticalapplicationsinspace,aerospace,defense,automotive,andindustrialsectors.
Key Products/TechnologiesKeyProducts/Technologies
High-Reliability Fuses are the sole QPL listed manufacturer of solid-body, current-limiting fuses produced using a thick-film technique for the aerospace industry. The company supplies FM12 style high-reliability fuses to NASA and other major manufacturers of satellite and spacecraft hardware worldwide.High-ReliabilityFusesarethesoleQPLlistedmanufacturerofsolid-body,current-limitingfusesproducedusingathick-filmtechniquefortheaerospaceindustry.ThecompanysuppliesFM12stylehigh-reliabilityfusestoNASAandothermajormanufacturersofsatelliteandspacecrafthardwareworldwide.
High-Reliability Ferrite Chip Beads are the world's sole manufacturer of such components designed for space and military use. These products are tested and approved to DSCC Drawing 03024, offering an operating temperature range of –55°C to +125°C and standard EIA/EIAJ chip sizes like 0603, 0805, and 1206.High-ReliabilityFerriteChipBeadsaretheworld'ssolemanufacturerofsuchcomponentsdesignedforspaceandmilitaryuse.TheseproductsaretestedandapprovedtoDSCCDrawing03024,offeringanoperatingtemperaturerangeof–55°Cto+125°CandstandardEIA/EIAJchipsizeslike0603,0805,and1206.
The product portfolio also includes SolidMatrix® and AirMatrix® SMD chip fuses, CMF High Power fuses, Thin Film fuses, Multilayer Varistors, Chip Inductors, High-Reliability Chip Resistors, and RF/Microwave to Millimeter Wave Components.TheproductportfolioalsoincludesSolidMatrix®andAirMatrix®SMDchipfuses,CMFHighPowerfuses,ThinFilmfuses,MultilayerVaristors,ChipInductors,High-ReliabilityChipResistors,andRF/MicrowavetoMillimeterWaveComponents.
Key technologies involve proprietary Sn-Pb plating and fusion processes for Tin Whisker Mitigation, alongside manufacturing capabilities for various discrete semiconductors such as transistors, diodes, MOSFETs, GaN FETs, and SiC MOSFETs.KeytechnologiesinvolveproprietarySn-PbplatingandfusionprocessesforTinWhiskerMitigation,alongsidemanufacturingcapabilitiesforvariousdiscretesemiconductorssuchastransistors,diodes,MOSFETs,GaNFETs,andSiCMOSFETs.
Core AdvantagesCoreAdvantages
A dominant and exclusive position in the circuit protection market within the aerospace industry.Adominantandexclusivepositioninthecircuitprotectionmarketwithintheaerospaceindustry.
Exceptional reliability and performance, with fuses operating in orbit for over 30 years and ferrite beads for over 15 years, both with zero reported failures.Exceptionalreliabilityandperformance,withfusesoperatinginorbitforover30yearsandferritebeadsforover15years,bothwithzeroreportedfailures.
Recognition from major customers like Northrop Grumman ("Gold Supplier Award"), Lockheed Martin Space Systems ("Certificate of Excellence"), and Boeing ("Performance Excellence Award"), underscoring high customer satisfaction and quality.RecognitionfrommajorcustomerslikeNorthropGrumman("GoldSupplierAward"),LockheedMartinSpaceSystems("CertificateofExcellence"),andBoeing("PerformanceExcellenceAward"),underscoringhighcustomersatisfactionandquality.
In-house manufacturing capabilities in San Diego, USA, utilizing proprietary materials, patented processes, and specialized equipment for high-reliability components.In-housemanufacturingcapabilitiesinSanDiego,USA,utilizingproprietarymaterials,patentedprocesses,andspecializedequipmentforhigh-reliabilitycomponents.
Adherence to stringent quality management systems and certifications, including AS9100D, MIL-STD-790, QPL MIL-PRF-23419/12 & /13, and DSCC 03024, ensuring the highest quality standards.Adherencetostringentqualitymanagementsystemsandcertifications,includingAS9100D,MIL-STD-790,QPLMIL-PRF-23419/12&/13,andDSCC03024,ensuringthehighestqualitystandards.
Proprietary technology for up-screening commercial ferrite chips to meet DSCC 03024 specifications, providing expanded supply and cost-effectiveness for high-reliability applications.Proprietarytechnologyforup-screeningcommercialferritechipstomeetDSCC03024specifications,providingexpandedsupplyandcost-effectivenessforhigh-reliabilityapplications.
AEC-Q200 Rev. E qualified and IATF 16949 certified automotive fuse lines, addressing the demanding requirements of the automotive market.AEC-Q200Rev.EqualifiedandIATF16949certifiedautomotivefuselines,addressingthedemandingrequirementsoftheautomotivemarket.
Target IndustriesTargetIndustries
Space (satellites, spacecraft, deep space probes, launch vehicles, space stations, scientific space telescopes).Space(satellites,spacecraft,deepspaceprobes,launchvehicles,spacestations,scientificspacetelescopes).
China (AEM Components manufacturing base for commercial components)China(AEMComponentsmanufacturingbaseforcommercialcomponents)
United States (headquarters and manufacturing facility in San Diego)UnitedStates(headquartersandmanufacturingfacilityinSanDiego)
Certifications/PatentsCertifications/Patents
AS9100D Quality Management System certification (applicable to management system, not product specific).AS9100DQualityManagementSystemcertification(applicabletomanagementsystem,notproductspecific).
MIL-STD-790 Quality Management System certification.MIL-STD-790QualityManagementSystemcertification.
QPL MIL-PRF-23419/12 & /13 qualification for high-reliability fuses.QPLMIL-PRF-23419/12&/13qualificationforhigh-reliabilityfuses.
DSCC 03024 specification approval and DLA approval for ferrite chip beads.DSCC03024specificationapprovalandDLAapprovalforferritechipbeads.
AEC-Q200 Rev. E and IATF 16949 certifications for automotive SMD fuses.AEC-Q200Rev.EandIATF16949certificationsforautomotiveSMDfuses.
U.S. Patent No. 6602766 for Ultraviolet/electron beam forming process for multi-layer electronic components.U.S.PatentNo.6602766forUltraviolet/electronbeamformingprocessformulti-layerelectroniccomponents.
U.S. Patent No. 6228230 for Electroplating apparatus.U.S.PatentNo.6228230forElectroplatingapparatus.
U.S. Patent No. 6844278 for Dense lead-free glass ceramic for electronic devices.U.S.PatentNo.6844278forDenselead-freeglassceramicforelectronicdevices.