Park Systems Corporation, established in 1997, is a specialized nanometrology equipment company, developing, producing, and selling Atomic Force Microscopes (AFM), Raman spectrometers, and Imaging Spectroscopic Ellipsometers. The company's core business involves the development, production, and sale of highly accurate and user-friendly AFMs, based on innovative technology and automated software. It provides precision metrology solutions for a wide range of advanced nanotechnology fields, including semiconductors, biotechnology, and secondary battery development, consistently setting new standards in precision and performance. With a global sales network spanning over 30 countries, the company boasts a history of over 25 years in the AFM industry.ParkSystemsCorporation,establishedin1997,isaspecializednanometrologyequipmentcompany,developing,producing,andsellingAtomicForceMicroscopes(AFM),Ramanspectrometers,andImagingSpectroscopicEllipsometers.Thecompany'scorebusinessinvolvesthedevelopment,production,andsaleofhighlyaccurateanduser-friendlyAFMs,basedoninnovativetechnologyandautomatedsoftware.Itprovidesprecisionmetrologysolutionsforawiderangeofadvancednanotechnologyfields,includingsemiconductors,biotechnology,andsecondarybatterydevelopment,consistentlysettingnewstandardsinprecisionandperformance.Withaglobalsalesnetworkspanningover30countries,thecompanyboastsahistoryofover25yearsintheAFMindustry.
Key Products/TechnologiesKeyProducts/Technologies
Atomic Force Microscopes (AFM): Small Sample AFM (Park NX-Hivac, Park NX-10, Park XE7, Park NX1, Park NX-Bio, Park NX-10 SICM, Park NX12), Large Sample AFM (Park NX20 300mm, Park NX20, Park XE15, Park FX200), Automated AFM (Park 3DM Series, Park Wafer Series, Park HDM Series, Park PTR Series, Park FX40).AtomicForceMicroscopes(AFM):SmallSampleAFM(ParkNX-Hivac,ParkNX-10,ParkXE7,ParkNX1,ParkNX-Bio,ParkNX-10SICM,ParkNX12),LargeSampleAFM(ParkNX20300mm,ParkNX20,ParkXE15,ParkFX200),AutomatedAFM(Park3DMSeries,ParkWaferSeries,ParkHDMSeries,ParkPTRSeries,ParkFX40).
Imaging Spectroscopic Ellipsometry (ISE): High-resolution optical metrology for thin film microanalysis.ImagingSpectroscopicEllipsometry(ISE):High-resolutionopticalmetrologyforthinfilmmicroanalysis.
Digital Holographic Microscopes (DHM): Non-contact 3D optical microscopy technology.DigitalHolographicMicroscopes(DHM):Non-contact3Dopticalmicroscopytechnology.
Active Vibration Isolation (AVI): Vibration isolation systems for enhanced measurement data quality.ActiveVibrationIsolation(AVI):Vibrationisolationsystemsforenhancedmeasurementdataquality.
AFM-IR Spectrometers: Nanoscale chemical analysis combining atomic force microscopy and infrared spectroscopy.AFM-IRSpectrometers:Nanoscalechemicalanalysiscombiningatomicforcemicroscopyandinfraredspectroscopy.
White Light Interferometry (WLI): High-speed, non-contact surface metrology with nanometer-level vertical resolution.WhiteLightInterferometry(WLI):High-speed,non-contactsurfacemetrologywithnanometer-levelverticalresolution.
True Non-Contact™ Mode: An exclusive scanning mode minimizing sample damage and tip wear by achieving high-resolution imaging without physical contact between the tip and sample, extending tip life.TrueNon-Contact™Mode:Anexclusivescanningmodeminimizingsampledamageandtipwearbyachievinghigh-resolutionimagingwithoutphysicalcontactbetweenthetipandsample,extendingtiplife.
Decoupled XY and Z Scanners: A flexure-based scanner architecture with separate XY and Z scanners, providing distortion-free, high-precision images with excellent linearity and orthogonality.DecoupledXYandZScanners:Aflexure-basedscannerarchitecturewithseparateXYandZscanners,providingdistortion-free,high-precisionimageswithexcellentlinearityandorthogonality.
SmartScan™ Software: AI-powered automated AFM operating software, enabling even inexperienced users to obtain expert-level, high-quality nanoscale images quickly and easily with a single click.SmartScan™Software:AI-poweredautomatedAFMoperatingsoftware,enablingeveninexperienceduserstoobtainexpert-level,high-qualitynanoscaleimagesquicklyandeasilywithasingleclick.
AdaptiveScan™: Technology that automatically adjusts scan speed based on the peaks and valleys of the sample surface, reducing imaging time while maintaining optimal image quality.AdaptiveScan™:Technologythatautomaticallyadjustsscanspeedbasedonthepeaksandvalleysofthesamplesurface,reducingimagingtimewhilemaintainingoptimalimagequality.
FastApproach™: Patented technology for automatic and safe probe-to-sample approach within 10 seconds of cantilever loading, without user intervention.FastApproach™:Patentedtechnologyforautomaticandsafeprobe-to-sampleapproachwithin10secondsofcantileverloading,withoutuserintervention.
PinPoint™ Nanomechanical Mode: Technology providing quantifiable mechanical property data of samples.PinPoint™NanomechanicalMode:Technologyprovidingquantifiablemechanicalpropertydataofsamples.
3D-AFM: Technology for precise vertical sidewall measurements of complex 3D structures such as GAA transistors and high-aspect-ratio 3D NAND.3D-AFM:Technologyforpreciseverticalsidewallmeasurementsofcomplex3DstructuressuchasGAAtransistorsandhigh-aspect-ratio3DNAND.
Core AdvantagesCoreAdvantages
Securing technological leadership and establishing high market entry barriers through proprietary core technologies and a global patent portfolio of over 200 patents.Securingtechnologicalleadershipandestablishinghighmarketentrybarriersthroughproprietarycoretechnologiesandaglobalpatentportfolioofover200patents.
Differentiated technological capability with the world's only True Non-Contact™ Mode, enabling high-resolution imaging without sample damage and extending tip life by more than 10 times, leading to reduced operating costs.Differentiatedtechnologicalcapabilitywiththeworld'sonlyTrueNon-Contact™Mode,enablinghigh-resolutionimagingwithoutsampledamageandextendingtiplifebymorethan10times,leadingtoreducedoperatingcosts.
Provision of distortion-free, high-precision images with excellent linearity and orthogonality, regardless of scan range or sample size, due to the Decoupled XY/Z scanner architecture.Provisionofdistortion-free,high-precisionimageswithexcellentlinearityandorthogonality,regardlessofscanrangeorsamplesize,duetotheDecoupledXY/Zscannerarchitecture.
Maximization of user convenience and productivity through AI-powered SmartScan™ software's automated functions, allowing even novice users to obtain expert-level data in a shorter time.MaximizationofuserconvenienceandproductivitythroughAI-poweredSmartScan™software'sautomatedfunctions,allowingevennoviceuserstoobtainexpert-leveldatainashortertime.
Market dominance as the global leader in the automated industrial AFM market, with strong partnerships and joint development with major semiconductor companies.MarketdominanceasthegloballeaderintheautomatedindustrialAFMmarket,withstrongpartnershipsandjointdevelopmentwithmajorsemiconductorcompanies.
Sustained technological innovation through a vertically integrated production system and high R&D investment, accounting for 15-18% of annual revenue, ensuring stable supply chain management and cost efficiency.SustainedtechnologicalinnovationthroughaverticallyintegratedproductionsystemandhighR&Dinvestment,accountingfor15-18%ofannualrevenue,ensuringstablesupplychainmanagementandcostefficiency.
Market leadership, holding the number one position in the global AFM market for two consecutive years with a 20.61% market share in 2023, according to QY Research.Marketleadership,holdingthenumberonepositionintheglobalAFMmarketfortwoconsecutiveyearswitha20.61%marketsharein2023,accordingtoQYResearch.
Strategic expansion of nanometrology portfolio and enhanced market competitiveness through acquisitions of specialized companies like Accurion GmbH and Lyncée Tec SA, adding Imaging Spectroscopic Ellipsometry and Digital Holographic Microscopy.StrategicexpansionofnanometrologyportfolioandenhancedmarketcompetitivenessthroughacquisitionsofspecializedcompanieslikeAccurionGmbHandLyncéeTecSA,addingImagingSpectroscopicEllipsometryandDigitalHolographicMicroscopy.
Target IndustriesTargetIndustries
Semiconductor Industry: Front-end and back-end process metrology, EUV mask defect detection and repair, CMP metrology, wafer edge profiling, copper pad metrology, advanced packaging, 3D chip architecture, HBM4 inspection, and overall nanoscale analysis and quality control in semiconductor manufacturing.SemiconductorIndustry:Front-endandback-endprocessmetrology,EUVmaskdefectdetectionandrepair,CMPmetrology,waferedgeprofiling,copperpadmetrology,advancedpackaging,3Dchiparchitecture,HBM4inspection,andoverallnanoscaleanalysisandqualitycontrolinsemiconductormanufacturing.
Materials Science: Development and characterization of new materials, nanoscale structure research.MaterialsScience:Developmentandcharacterizationofnewmaterials,nanoscalestructureresearch.
Life Sciences and Biotechnology: High-resolution imaging of live cells and DNA, biological sample analysis, pharmaceutical research, and diagnostics.LifeSciencesandBiotechnology:High-resolutionimagingoflivecellsandDNA,biologicalsampleanalysis,pharmaceuticalresearch,anddiagnostics.
Display Technology: High-precision non-destructive measurement and large sample analysis for flat panel display manufacturing, including OLED, LCD, and photonics.DisplayTechnology:High-precisionnon-destructivemeasurementandlargesampleanalysisforflatpaneldisplaymanufacturing,includingOLED,LCD,andphotonics.
Data Storage Industry: Precise nanoscale surface analysis of HDD heads and substrates, automated defect detection.DataStorageIndustry:PrecisenanoscalesurfaceanalysisofHDDheadsandsubstrates,automateddefectdetection.
Nanotechnology Research: Nanoscale measurement and imaging in various fundamental science fields.NanotechnologyResearch:Nanoscalemeasurementandimaginginvariousfundamentalsciencefields.
Chemistry and Physics Research: Analysis of electrical, mechanical, magnetic, thermal properties, and surface topography of materials.ChemistryandPhysicsResearch:Analysisofelectrical,mechanical,magnetic,thermalproperties,andsurfacetopographyofmaterials.
Secondary Battery Development: Nanoscale analysis of battery materials and structures.SecondaryBatteryDevelopment:Nanoscaleanalysisofbatterymaterialsandstructures.
Quality Control: Nanoscale quality inspection and management for products across various industries.QualityControl:Nanoscalequalityinspectionandmanagementforproductsacrossvariousindustries.
Major MarketsMajorMarkets
South Korea, China, Japan, Singapore, Taiwan, India, VietnamSouthKorea,China,Japan,Singapore,Taiwan,India,Vietnam
Germany, Switzerland, United Kingdom, FranceGermany,Switzerland,UnitedKingdom,France
United States, MexicoUnitedStates,Mexico
OceaniaOceania
Certifications/PatentsCertifications/Patents
Possession of a global patent portfolio exceeding 200 patents.Possessionofaglobalpatentportfolioexceeding200patents.
Registration of 43 domestic and international patents in the field of atomic force microscopy.Registrationof43domesticandinternationalpatentsinthefieldofatomicforcemicroscopy.
Key patents include methods and devices for acquiring surface information of measurement targets with optical measurement devices for AFM, and target position recognition apparatuses and methods for AFM.KeypatentsincludemethodsanddevicesforacquiringsurfaceinformationofmeasurementtargetswithopticalmeasurementdevicesforAFM,andtargetpositionrecognitionapparatusesandmethodsforAFM.
Patents related to methods for obtaining surface properties of measurement targets using tilted tips (associated with the 3DM™ model).Patentsrelatedtomethodsforobtainingsurfacepropertiesofmeasurementtargetsusingtiltedtips(associatedwiththe3DM™model).
Patents related to True Non-Contact Mode™ technology.PatentsrelatedtoTrueNon-ContactMode™technology.
Patents related to FastApproach™ and SmartScan™ software.PatentsrelatedtoFastApproach™andSmartScan™software.
Designation of industrial AFM technology as a National Core Technology by the South Korean government in 2010.DesignationofindustrialAFMtechnologyasaNationalCoreTechnologybytheSouthKoreangovernmentin2010.
Recipient of the Frost & Sullivan 2016 Global Enabling Technology Leadership Award.RecipientoftheFrost&Sullivan2016GlobalEnablingTechnologyLeadershipAward.
Recipient of the 2024 Semiconductor Equipment Excellence Award.Recipientofthe2024SemiconductorEquipmentExcellenceAward.
Selected for Forbes Asia's 200 Best Under a Billion in 2020.SelectedforForbesAsia's200BestUnderaBillionin2020.