Chat with us, powered by LiveChat Fully Automated, Topside or Backside Mask Aligner for Production | Seimyuing Vactron - Komachine
Product Name Fully Automated, Topside or Backside Mask Aligner for Production
Model 6000 FSA
Series OAI Mask Aligner
Product Description

For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

① Fully Automated
② Topside Alignment
③ Optional: Bottomside Alignment
④ DUV to NUV
⑤ Cluster Tool Integration
⑥ Customized Software


Exposure System
Exposure Modes Vacuum contact Hard contact Soft contact Proximity (2μ gap)
Advanced Beam Optics
Uniform Beam Size 50mm - 200mm square/round
200mm - 300 mm square/round
Uniformity Better than ±3%
Camera Dual Camera with CCTV with Expanded Depth of Field
Alignment System
Pattern Recognition Cognex visionPro¹™ with OAI customized software
Alignment Accuracy 0.5μ topside
1.0μ with top to bottom optional backside alignment
Pre-alignment Accuracy Better than ±50μ
Auto-alignme Top to bottomside
Wafer Handling
Substrate size 50mm – 200mm round or square or 200mm-300mm round or square
Thin wafers Down to 100Μ
Warped Wafers Up to 7mm-10mm
Thick & Bonded Substrates Up to 7000μ
Robotics Single and dual arm wafer handling
Run-out compensation Standard software or optional thermal chuck
Wafer size conversion 5 minutes or less
Throughput 1st mask 180 wafers per hour - subsequent 75-100 wafers per hour
Wedge Effect Leveling 3 point or optional non-contact
Available Options
IR Auto-align,Cassette Mapping365nm LED Exposure Light Source Temperature Controlled Wafer Chuck Integrated Mask Management Control Integrated Lithography Cluster for Full Lithography Process Environment Control with SMIF or FOUP Interface Modules Non-contact Leveling Edge Gripping

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