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Product Name Silicon Wafer
Model
Series Solar & LED Machine
Catalog
Product Description

Processing equipment needed for the process through which silicon ingot important for solar cell production is made with wafers.

 

 

- Tool : Diamond O.D Saw
- Seed Cutting : Cuts silicon ingot with seed rod through various processes
- Production of high-speed, multi-purpose and maximum quantities of seed rods

 

DAEOUNG MACHINERY Silicon Wafer

 

Processing Method

Seed Cutting

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- Tool : Diamond O.D Saw
- Cropping : Cuts a specific or unnecessary part
- Sample Cutting : cutting of the sample of 1~2mm thick
- Compact, high-speed and multi-purpose cutting and processing

 

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Processing Method

Cropping

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- Tool : Diamond O.D Saw
- Top & Tail Cutting : Cuts both ends of silicon ingot
- Cropping : Cuts silicon ingot in fixed lengths
- Sample Cutting : Cuts the sample of 1~2mm thick
- High-speed and multi-purpose cutting and precision

 

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Processing Method

Cropping

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- Tool : Diamond O.D Saw & Diamond Cup Wheel 
- Squaring : Cuts four sides of silicon ingot with a square brick
- Surface Grinding : Grinds a surface side squared in desired size and roughness
- Round Grinding : Cylindrical grinding of a irregular round side at a desired size
- High-speed, high-precision and loading & unloading auto processing

 

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Processing Method

SQUARE CUTTING

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SURFACE GRINDING

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ROUND GRINDING

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Centerless Grinding Machine