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Product Name Memory Test Socket
Model
Series Products
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Product Description

Memory Test Socket

Using advanced precision injection molding equipment and patented technology, LEENO can provide molded sockets for various package sizes for memory sockets.
 


Specifications

- Package Type

BGA, TSOP etc.


- Pitch

0.30P~


- Customizing

GPS (Device Alignment System), Floating Type, Hybrid BK Type

 

Product Series

LEENO Memory Test Socket

Products of LEENO