케이셈테크놀러지
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Overview
Basic Information
Model name : AD-400
As the production of Fan-out Panel Level Packages increases, the purpose of increasing I/O density and production yield Precise Bonding Accuracy and UPH Improvement, Customized Pick and Placement for Each Customer Equipment development required
Features
1. High productivity : UPH 15K
2. Applied panel size : 615x625mm
3. High placement accuracy : Local ±8㎛@3σ / Global ±15㎛@3σ
4. Temprature : Bond head 150°C / Bond stage 150°C
5. Face up & Face down
6. Auto tool change : Bond, Pickup tool
7. Multi ejector system
8. Auto panel load_unload system
9. Wafer auto change system
10 .100class cleanness of FFU