Overview

 

Basic Information

Model name : AD-400

As the production of Fan-out Panel Level Packages increases, the purpose of increasing I/O density and production yield Precise Bonding Accuracy and UPH Improvement, Customized Pick and Placement for Each Customer Equipment development required

 

Features

1. High productivity : UPH 15K

2. Applied panel size : 615x625mm

3. High placement accuracy : Local ±8㎛@3σ  / Global ±15㎛@3σ 

4. Temprature : Bond head 150°C / Bond stage 150°C

5. Face up & Face down

6. Auto tool change : Bond, Pickup tool

7. Multi ejector system

8. Auto panel load_unload system

9. Wafer auto change system

10 .100class cleanness of FFU