케이셈테크놀러지
Series2
제품
5High-speed, high-accuracy die bonder for 8 inch wafer IC･LSI
AD-100
High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
AD-200
High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
AD-300
High performance FO-PLP BONDER
AD-400
Tape Full Auto Lamination For Cell
ALM-100
