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코리아바큠테크

코리아바큠테크

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시리즈

Sputter


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031-987-6320

제품 상세 설명

Korea Vacuum Tech  KVS-4000 Series

Overview

Sputter deposition is a technique used to deposit thin films of a material onto a surface

(substrate). Atoms and ions of a given material are made to collide. The resulting

momentum exchange disperses incident ions which further perpetuate activity setting

off collision cascades in the target. This activity drives the sputtering process. When

such cascades recoil and reach the target surface with an energy above the surface

binding energy, and atom can be ejected. If the target is thin on an atomic scale the

collision cascade can reach the back side of the target and atoms can escape the

surface binding energy in transmission. The average number of atoms ejected from the

target per incident ion is called the “sputter yield” and depends on the ion incident

angle, the energy of the ion, the masses of the ion and target atoms, and the surface

binding energy of atoms in the target.

 

Features

≻ Excellent Thickness Uniformity

        The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of

        resultant films even for substrates that have the same diameter as the sputtering cathode assembly

≻ Full Auto control

        These systems provide the ‘auto button’ to user for convenience of user. Fully automated vacuum

        process control system.

≻ No Loadlock chamber


Process Chamber

Stainless steel

Vacuum Pumping Station

Turbo molecular pump

Loadlock Chamber

Stainless steel

Substrate Heating Unit

SiC / 2”, 3”, 4”, 6”, 8”

Sample Loading/Unloading Unit

Full auto / Semi-auto

Pressure Control Unit

Vacuum Gauge Controller

ATM ~ 1.0E-10Torr

Gas Supply Unit

MFC (Ar, O2, N2, H2, etc..)

Power Supply Unit

RF / DC / Pulsed DC

Target Size

2”, 3”, 4”, 6”

Film Thickness Uniformity

Less than ±5%

Ultimate Pressure

Less than 5.0E-7Torr


Korea Vacuum Tech  KVS-4000 Series 1

Korea Vacuum Tech  KVS-4000 Series 2

Overview

Sputter deposition is a technique used to deposit thin films of a material onto a surface

(substrate). Atoms and ions of a given material are made to collide. The resulting

momentum exchange disperses incident ions which further perpetuate activity setting

off collision cascades in the target. This activity drives the sputtering process. When

such cascades recoil and reach the target surface with an energy above the surface

binding energy, and atom can be ejected. If the target is thin on an atomic scale the

collision cascade can reach the back side of the target and atoms can escape the

surface binding energy in transmission. The average number of atoms ejected from the

target per incident ion is called the “sputter yield” and depends on the ion incident

angle, the energy of the ion, the masses of the ion and target atoms, and the surface

binding energy of atoms in the target.

Features

 ≻ Excellent Thickness Uniformity

         The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of resultant films

         even for substrates that have the same diameter as the sputtering cathode assembly

≻ Full Auto control

        These systems provide the ‘auto button’ to user for convenience of user.

        Fully automated vacuum process control system.

≻ Always maintain high vacuum degree in process

        These systems have a process chamber and a loadlock chamber.

        Loadlock chamber is used for sample loading. So process chamber is always maintained high vacuum state.


Process Chamber

Stainless steel

Vacuum Pumping Station

Turbo molecular pump

Loadlock Chamber

Stainless steel

Substrate Heating Unit

SiC / 2”, 3”, 4”, 6”, 8”

Sample Loading/Unloading Unit

Full auto / Semi-auto

Pressure Control Unit

Vacuum Gauge Controller

ATM ~ 1.0E-10Torr

Gas Supply Unit

MFC (Ar, O2, N2, H2, etc..)

Power Supply Unit

RF / DC / Pulsed DC

Target Size

2”, 3”, 4”, 6”

Film Thickness Uniformity

Less than ±5%

Ultimate Pressure

Less than 5.0E-7Torr


Korea Vacuum Tech  KVS-4000 Series 3

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