Semi COG Bonder (24") by Yujin Discom - Komachine Supplier Profile and Product List

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Yujin Discom

Semi COG Bonder (24")

Model

Series

Large Machine

Transaction Process

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Delivery

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Shipment

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Origin

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Description

본 설비는 LCD GLASS 위에 IC Chip을 부착하는 설비이다. IC Chip은 Robot에 의해 Tray에서 자동 공급되며 LCD GLASS Loading Unloading을 수동으로 하면 Alignment에서 IC Chip Bonding까지 자동으로 작업한다.

SPECIFICATIONS
EQUIP. DIMENSION	1160(L)mm×840(W)mm×1690(H)mm
WEIGHT	500Kg
IC CHIP SIZE	4~23mm(L), 1.0~5mm(W)
GLASS SIZE	1.0” ~ 7.0”
PATTERN PITCH	38 ㎛ (25㎛ 2열 배열시)
BONDING ACCURACY	±5 ~ 6 ㎛
TACKTIME(1 IC BONDING)	9~12sec
AILGNMENT	Vision System (Auto Alignment)
BONDING HEAD 수량	2 Head
UTILITY	MAIN POWER:220V±10%, 2.0KW, 50/60Hz
UTILITY	AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose

Inquiry

Komachine Inc.

Head Office:

Ace Dongbaek Tower 1-1101, 16-4,

Dongbaekjungang-ro 16beon-gil, Giheung-gu,

Yongin City, Gyeonggido, South Korea 17015

Branch Office:

606, Seoul Stratup Center, 10,

Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938

CEOCharlie Park

Corporate #535-86-00664