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Yujin Discom
FPC Bonder (R-L)
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Description
This machine is to bond the ACF attached panel with manually aligned FPC film by heat and pressure. (Left-Right moving type, 2 head / 2 moving stage)
SPECIFICATIONS
EQUIP. DIMENSION
900(L)mm×650(W)mm×1700(H)mm
WEIGHT
400Kg
LCD GLASS SIZE
30~80(L), 20~70(W)
LCD GLASS THICKNESS
(0.3~1.1)*2mm
PATTERN PITCH
50 ㎛ (max)
CAMERA SYSTEM
F.O.V(FIELD OF VIEW) : X=1.5~3mm
BONDING ACCURACY
±10~13㎛
BONDING PRESSURE
1.5~35 Kgf, Temp.: RT~350℃
TACK TIME
16~18sec(bonding time 13sec)
UTILITY
MAIN POWER:220V±10%,1.0KW, 50/60Hz
AIR : 5~6 Kg/cm2, 350L/min, Ø8 Hose
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