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Yujin Discom

Yujin Discom

Yujin Discom

Yujin Discom

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Yujin Discom

Yujin Discom

FPC Bonder (R-L)

Model

Series

Module Line

Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

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Description

This machine is to bond the ACF attached panel with manually aligned FPC film by heat and pressure. (Left-Right moving type, 2 head / 2 moving stage)

 

SPECIFICATIONS

EQUIP. DIMENSION

900(L)mm×650(W)mm×1700(H)mm

WEIGHT

400Kg

LCD GLASS SIZE

30~80(L), 20~70(W)

LCD GLASS THICKNESS

(0.3~1.1)*2mm

PATTERN PITCH

50 ㎛ (max)

CAMERA SYSTEM

F.O.V(FIELD OF VIEW) : X=1.5~3mm

BONDING ACCURACY

±10~13㎛

BONDING PRESSURE

1.5~35 Kgf,  Temp.: RT~350℃

TACK TIME

16~18sec(bonding time 13sec)

UTILITY

MAIN POWER:220V±10%,1.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 350L/min, Ø8 Hose

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.