Semi COG Bonder (2Head) by Yujin Discom - Komachine Supplier Profile and Product List

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Yujin Discom

Semi COG Bonder (2Head)

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Description

This machine is to bond the IC chip on the LCD glass. IC chip supplied automatically from the tray by robot arm. LCD glass loading is manual, alignment and IC chip bonding is automatic. (ACF bonding process should be done with ACF bonding machine.)

SPECIFICATIONS
EQUIP. DIMENSION	1160(L)mm×840(W)mm×1690(H)mm
WEIGHT	500Kg
IC CHIP SIZE	4~23mm(L), 1.0~5mm(W)
GLASS SIZE	1.0” ~ 7.0”
PATTERN PITCH	38 ㎛ (25㎛ 2 line )
BONDING ACCURACY	±5 ~ 6 ㎛
TACKTIME(1 IC BONDING)	9~12sec
AILGNMENT	Vision System (Auto Alignment)
BONDING HEAD	2 Head
UTILITY	MAIN POWER:220V±10%, 2.0KW, 50/60Hz
UTILITY	AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose

Inquiry

Komachine Inc.

Head Office:

Ace Dongbaek Tower 1-1101, 16-4,

Dongbaekjungang-ro 16beon-gil, Giheung-gu,

Yongin City, Gyeonggido, South Korea 17015

Branch Office:

606, Seoul Stratup Center, 10,

Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938

CEOCharlie Park

Corporate #535-86-00664