ACF Bonder by Yujin Discom - Komachine Supplier Profile and Product List

Yujin Discom

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Yujin Discom

ACF Bonder

Model

Series

Module Line

Transaction Process

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Origin

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Description

This machine is to attach the ACF which is the medium within panel and FPC, TAB and IC CHIP, on the panel.

SPECIFICATIONS
EQUIP. DIMENSION	700(L)mm×635(W)mm×1640(H)mm
WEIGHT	150Kg
GLASS SIZE	16~75(W)mm, 15~61(L)mm <3.5”max>
ACF FEEDING LENGTH	4~75mm(L), 1~5mm(W)
TACT TIME	5~8sec
BONDING ACCURACY	±0.3mm(L), ±0.1mm(W)
ACF FEEDING	Air Cylinder & Micrometer head
ACF PROTECTIVE FILM REMOVE	Vacuum
PRESSING TOOL	Air Cylinder
UTILITY	MAIN POWER:220V±10%,0.5KW, 50/60Hz
UTILITY	AIR : 5~6 Kg/cm2, 180L/min, Ø8 Hose

Inquiry

Komachine Inc.

Head Office:

Ace Dongbaek Tower 1-1101, 16-4,

Dongbaekjungang-ro 16beon-gil, Giheung-gu,

Yongin City, Gyeonggido, South Korea 17015

Branch Office:

606, Seoul Stratup Center, 10,

Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938

CEOCharlie Park

Corporate #535-86-00664