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Copper Oxide

Model

Series

General Plating & Materials


Transaction Process

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Origin

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Description

ㆍCharacteristics

ECO-10: Black Powder Form Copper Oxide(CuO)
For the plating of PCB & Electroless Copper plating solution

ㆍApplication

Wafer EP-Cu, PCB-PKG, HDI, MLB

ㆍSpecification

· Rapid disscolution rate (within 10sec.)
· Low Cl content (below 10ppm)
· High purity and superior flowability
· Various packing unit

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.