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TKC

TKC

COF (Chip on film), 2Metal process Equipment

Model

Series

Roll To Roll


Transaction Process

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Payment

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Delivery

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Shipment

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Origin

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Description

ㆍCharacteristics

COF(Chip on film), 2Metal process Equipment
For the Double-side circuit Production process

ㆍApplication

Desmear, E'less Cu, Cu Via Fill & E'less Sn plating
 - Film width : 156mm, 182mm, variable
 - Thickness : PI 35㎛ + Cu 0.8㎛ (both ?side)

ㆍSpecification

· Stable Transportation by Servo Drive for Whole Process
· Excellent Plating Thickness Uniformity (≤10%)
· Tension Control System for Product Transportation
· Optimize Driving System for all structure
· For Vertical & Horizontal Equipment Structure
· Capability of the Process Customization by Chemicals

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.