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VCP Cu-Plating Equipment

Model

Series

PCB


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

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Description

ㆍCharacteristics

VCP Cu-Plating Euipment
Increase Throwing power in the process of PCB production

ㆍApplication

HDI, PKG, FPC, Automobile
 - Customization Available
   : Board size, Thickness, Capacity, Layout, etc.

ㆍSpecification

· Minimize the Board damage by Auto LD/ULD System
· Easy Maintenance Apply with Compact Hanger Structure 
· Layout of Factory Space-Maxmizing
· The Adjustable Jig for Ultra-Thin Board (Patented Item)
· Capability of Uniform Conductivity by hangers (Current-Feed Rail)
· Designed by units for the Timeliness of the production (Lead Time)

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.