System Engineering Mega Solution
System Engineering Mega Solution
MICHELAN O2
Model
Series
Semiconductor Equipment
Transaction Process
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Payment
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Delivery
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Shipment
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Origin
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Description
Overview
CCP Type Plasma Etcher for HARC Etching and Via/Dama Etching Process
Feature
Process performance
- Specialized Critical Etch Process
: DRAM, Flash, 3D NAND and Logic Applications
- Low Particle / Verticle Etching
- High Etch Rate / High Mask Selectivity
- Precise CD and CD Uniformity Control
- Low Micro-loading Effect
Productivity / Hardware
- Cluster Transfer Module : Max. 6 Chambers
- RF Sync Pulse Function : High Aspect Ratio
- Radial Uniformity Control HW : Gas and Temperature
- Low C.o.O / Long MTBC
- High Throughput