3D SPI equipment performs 3D inspection on defects in height, volume, area, shape, bridge and position of solder on PCB after screen printing in the SMT process, this applies the unique 3D measurement technique of our company called FAHP, which satisfies short line cycle time required by the PCB manufacturing process, accommodates for parts with micro pitch, resolves the problem of measurement error caused by substrate bending, and settles the problem of solder paste shadow and mirror reflection. This product, based on such innovative technology, provides an optimal solution for zero defect screen printer process based on faster inspection rate, higher defect detection rate, lower false defect rate and higher measurement precision than existing inspection systems.