Synapse Imaging
Image Sensor Package Inspection System
Model
Series
Semiconductor
Transaction Process
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Description
CMOS Image Sensor Inspection System is an optical vision inspection system that inspects various external defects which occur in the sensor die top surface, pixel area, per unit for which die bonding is completed in PCB strip state during CIS package assembly process or inspects defects on cover glass surfaces which is top, bottom and die surface of package mounted on a tray as unit.