Suhwoo Technology Co., Ltd. was founded by seven professional engineers in Oct 1990 for the purpose of becoming the world best company in the Semiconductor mold.
In the year 1990s. Suhwoo Technology developed long life 0.4mm pitch QFP 256pin Damber Punch/Die by sutface grinding machine with diamond wheel machining technology as the nation's first in korea and exported to world global companies as Amkor, Samsung, Toshiba, Matsushita.
in the year 2000. we entered automation system by developing QFN punch Singulation System at the beginning. and Suhwoo Technology sells various automation systems such as Loader/ Unloader. Vision Off Loader. Air Blower System and pressure Oven to domestic and foreign contrelliong molding thickness with high according to Semiconductor development trends.
Suhwoo Technology will lead a Semiconductor Package Strip Grinder Application with continuous investment and development. Furthetmore, Suhwoo Tehcnology will develop a world competitive system even in the Wafer Mold Grinding System.
|Company Address||77-76, Seokgok 3-gil, Seongnam-myeon, Dongnam-gu, Cheonan-si, Chungcheongnam-do, Korea|