Step System, The Republic of Korea - Komachine Supplier Profile and Product List

- Step System Co., Ltd. is a specialized company established in 1997, focusing on semiconductor equipment development and electronic component manufacturing. A company that has evolved its core business into high-layer semiconductor test PCB design and production. Recently, a company that successfully expanded its business scope by developing 'ICECAT,' an electric vehicle battery fire suppression solution. A company pursuing continuous growth with its existing semiconductor test solutions and future growth engine, electric vehicle safety solutions, as dual pillars. A company also possessing diverse products and technological capabilities in memory modules and IT solutions.Step System Co., Ltd. is a specialized company established in 1997, focusing on semiconductor equipment development and electronic component manufacturing. A company that has evolved its core business into high-layer semiconductor test PCB design and production. Recently, a company that successfully expanded its business scope by developing 'ICECAT,' an electric vehicle battery fire suppression solution. A company pursuing continuous growth with its existing semiconductor test solutions and future growth engine, electric vehicle safety solutions, as dual pillars. A company also possessing diverse products and technological capabilities in memory modules and IT solutions.
- LSI Test Solution: Semiconductor test board solutions such as Final Test Board, Wafer Test Board, and Mother Board (PRVX). Capability to develop and supply core components used for electrical characteristic inspection of semiconductor wafers and final products [DB, 7, 11].LSI Test Solution: Semiconductor test board solutions such as Final Test Board, Wafer Test Board, and Mother Board (PRVX). Capability to develop and supply core components used for electrical characteristic inspection of semiconductor wafers and final products [DB, 7, 11].
- Memory Test Solution: Memory test solutions including Hi-Fix System and Socket Board. Possession of systems and board products for precise testing of memory modules [DB, 7, 11, 17, 18].Memory Test Solution: Memory test solutions including Hi-Fix System and Socket Board. Possession of systems and board products for precise testing of memory modules [DB, 7, 11, 17, 18].
- I.T Solution / SMT: IT and SMT-related solutions such as AP Chip Application System, Car Navigation Solution, SMT Assembly Line, AI Thermal Camera, and Tuyere Camera. The SMT Assembly Line specifically includes equipment like Solder Printer (HP-680S), Mounter (SM320, SM421), and Reflower (Heller 1910MKV) [DB, 7, 11, 16, 22].I.T Solution / SMT: IT and SMT-related solutions such as AP Chip Application System, Car Navigation Solution, SMT Assembly Line, AI Thermal Camera, and Tuyere Camera. The SMT Assembly Line specifically includes equipment like Solder Printer (HP-680S), Mounter (SM320, SM421), and Reflower (Heller 1910MKV) [DB, 7, 11, 16, 22].
- AI Thermal Camera: An AI-based thermal screening system integrating a 2.1-megapixel high-definition CCTV camera and a thermal camera. Equipped with high-precision intelligent face capture algorithms and ISP image processing technology, offering remote motion detection and simultaneous detection of high-definition face images and body temperature [16].AI Thermal Camera: An AI-based thermal screening system integrating a 2.1-megapixel high-definition CCTV camera and a thermal camera. Equipped with high-precision intelligent face capture algorithms and ISP image processing technology, offering remote motion detection and simultaneous detection of high-definition face images and body temperature [16].
- R&D Technology: Advanced PCB design and manufacturing capabilities including PCB Manufacture Technology (max 80 layers, 7.4T thickness, 610*720mm panel size, 2.0/2.5mil internal trace & space, 0.25mm min BGA pitch), ATE Board Design Technology, PCB Simulation Technology (utilizing Sigrity PowerDC, Speed2000, SystemSI), and DRC/ERC Technology [7, 10, 11, 13, 14, 25].R&D Technology: Advanced PCB design and manufacturing capabilities including PCB Manufacture Technology (max 80 layers, 7.4T thickness, 610*720mm panel size, 2.0/2.5mil internal trace & space, 0.25mm min BGA pitch), ATE Board Design Technology, PCB Simulation Technology (utilizing Sigrity PowerDC, Speed2000, SystemSI), and DRC/ERC Technology [7, 10, 11, 13, 14, 25].
- Electric Vehicle Battery Safety Solution: ICECAT is a specialized firefighting equipment that effectively controls thermal runaway in EV battery fires. A solution adopting an innovative method of drilling directly into the battery pack and injecting coolant internally [2].Electric Vehicle Battery Safety Solution: ICECAT is a specialized firefighting equipment that effectively controls thermal runaway in EV battery fires. A solution adopting an innovative method of drilling directly into the battery pack and injecting coolant internally [2].
- High Technical Expertise: Over 28 years of accumulated specialized technical expertise in high-layer semiconductor test PCB design since 1997. Capability to develop and produce ultra-high-layer (62 Layer) high-value PCBs, securing trust in the domestic and international semiconductor industry [DB, 2, 3, 4, 14].High Technical Expertise: Over 28 years of accumulated specialized technical expertise in high-layer semiconductor test PCB design since 1997. Capability to develop and produce ultra-high-layer (62 Layer) high-value PCBs, securing trust in the domestic and international semiconductor industry [DB, 2, 3, 4, 14].
- Innovative Business Diversification: Establishing a new high-value-added market by developing 'ICECAT,' an EV battery fire suppression equipment, on top of the stable revenue base from existing semiconductor test solutions. A strategy to secure future growth engines and expand the business portfolio [2].Innovative Business Diversification: Establishing a new high-value-added market by developing 'ICECAT,' an EV battery fire suppression equipment, on top of the stable revenue base from existing semiconductor test solutions. A strategy to secure future growth engines and expand the business portfolio [2].
- Provision of Customer-Specific Solutions: A strong point in developing customized products for various demands from semiconductor manufacturers and post-processing companies. Flexible response capabilities to meet specific customer needs [2].Provision of Customer-Specific Solutions: A strong point in developing customized products for various demands from semiconductor manufacturers and post-processing companies. Flexible response capabilities to meet specific customer needs [2].
- Advanced Simulation and Manufacturing Capabilities: Ability to deeply analyze design performance and ensure reliability using PCB Simulation Technology. Expertise in maximizing product quality and performance through DRC/ERC technology and precise PCB manufacturing techniques [10, 13].Advanced Simulation and Manufacturing Capabilities: Ability to deeply analyze design performance and ensure reliability using PCB Simulation Technology. Expertise in maximizing product quality and performance through DRC/ERC technology and precise PCB manufacturing techniques [10, 13].
- Continuous R&D Investment: Consistent investment in research and development to secure proprietary core technologies. Ability to proactively respond to market changes by continuously expanding the technology portfolio [2].Continuous R&D Investment: Consistent investment in research and development to secure proprietary core technologies. Ability to proactively respond to market changes by continuously expanding the technology portfolio [2].
- Integrated IT and SMT Solutions: Possession of a diverse range of IT and SMT-related product lines, including AP Chip Application System, Car Navigation Solution, and SMT Assembly Line. Capability to provide solutions integrating cutting-edge technologies like AI Thermal Camera [7, 16, 22].Integrated IT and SMT Solutions: Possession of a diverse range of IT and SMT-related product lines, including AP Chip Application System, Car Navigation Solution, and SMT Assembly Line. Capability to provide solutions integrating cutting-edge technologies like AI Thermal Camera [7, 16, 22].
- Semiconductor Industry: Supplying core test solutions such as wafer test boards, final test boards, and motherboards to semiconductor manufacturers and Outsourced Semiconductor Assembly and Test (OSAT) companies [2, 7].Semiconductor Industry: Supplying core test solutions such as wafer test boards, final test boards, and motherboards to semiconductor manufacturers and Outsourced Semiconductor Assembly and Test (OSAT) companies [2, 7].
- Automotive Industry: Entry into the automotive electronics market through the development and supply of Car Navigation Solutions [3, 7, 11].Automotive Industry: Entry into the automotive electronics market through the development and supply of Car Navigation Solutions [3, 7, 11].
- Electric Vehicle and Safety Industry: Supplying 'ICECAT' EV battery fire suppression equipment to EV manufacturers, fire departments, public institutions, and large charging facilities [2].Electric Vehicle and Safety Industry: Supplying 'ICECAT' EV battery fire suppression equipment to EV manufacturers, fire departments, public institutions, and large charging facilities [2].
- IT and Electronic Components Industry: Contributing to various electronic product and IT device manufacturing fields through AP Chip Application Systems and SMT Assembly Lines [7, 11, 22].IT and Electronic Components Industry: Contributing to various electronic product and IT device manufacturing fields through AP Chip Application Systems and SMT Assembly Lines [7, 11, 22].
- Security and Quarantine Industry: Application in security and quarantine sectors with AI Thermal Cameras for fever detection and access control systems [16].Security and Quarantine Industry: Application in security and quarantine sectors with AI Thermal Cameras for fever detection and access control systems [16].
- Technological prowess with a total of 22 patents [2].Technological prowess with a total of 22 patents [2].
- Transparency in disclosing patent status and certification status through its official website [7].Transparency in disclosing patent status and certification status through its official website [7].
- Securing technology for the development and production of ultra-high-layer (62 Layer) PCBs [3, 14].Securing technology for the development and production of ultra-high-layer (62 Layer) PCBs [3, 14].
- Technological capability in developing the innovative 'ICECAT' equipment for controlling battery thermal runaway [2].Technological capability in developing the innovative 'ICECAT' equipment for controlling battery thermal runaway [2].
- Extensive experience and know-how in precision mechanical design and control technology [2].Extensive experience and know-how in precision mechanical design and control technology [2].