SHONICS
SHONICS
Description
System Specification
|
Measurement |
1. Thickness & Flatness 2. Bow & 15 points Warp |
|
Wafer Inner Inspection |
1. Micro Crack Detection 2. Inner Bubble & Defects Detection |
|
Wafer Surface Inspection |
1. Surface Crack Detection |
※ This system can be customized for the customer's needs.
Solar Cell Inspection System
Solar Wafer Production Line has a problem to achieve mass production because of the standardization and automation problems.
This system is vision inspection technoly applied and has automatic operating capability.
ㆍ Thickness variation measurement techniques which use laser technology (ASTM standard)
ㆍ Micro crack and internal defect detection
ㆍ Available for both inline and parts auto inspection
ㆍ Geometric and optical solar cell wafer defect detection
ㆍ 3D Wafer Drawing
Througe this system quality stability and higher productivity can be achived.