ㆍHigh Speed and Accuracy Flip-Chip Bonding system
ㆍLinear Bond head with touch down control
ㆍFull bump Inspection and post Inspection capability
ㆍMCM(multi-chip module) capability(Dual Wafer)
ㆍWafer Mapping and SECS/GEM
Inquiry
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938