Flip-chip Attach system PRO-7020FC by PROTEC - Komachine Supplier Profile and Product List

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PROTEC

Flip-chip Attach system

Model

Series

System Business Group

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Description

PRO-7020FC : Flip-chip Attach system

ㆍHigh Speed and Accuracy Flip-Chip Bonding system
ㆍLinear Bond head with touch down control
ㆍFull bump Inspection and post Inspection capability
ㆍMCM(multi-chip module) capability(Dual Wafer)
ㆍWafer Mapping and SECS/GEM

PROTEC Flip-chip Attach system PRO-7020FC

Inquiry

Komachine Inc.

Head Office:

Ace Dongbaek Tower 1-1101, 16-4,

Dongbaekjungang-ro 16beon-gil, Giheung-gu,

Yongin City, Gyeonggido, South Korea 17015

Branch Office:

606, Seoul Stratup Center, 10,

Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938

CEOCharlie Park

Corporate #535-86-00664