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LASER & PHYSICS

LASER & PHYSICS

LASER & PHYSICS

LASER & PHYSICS

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LASER & PHYSICS

LASER & PHYSICS

Excimer laser annealing system

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Description

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Excimer laser annealing system



Products Introduction

Model   LPA-EXA100
Laser type    XeCl
Wave Length    308 mm
Pulse repetion rate   < 30 Hz
Average energy   < 500mJ
Power stability   5 %
Warming up   30 min.
Gas lifetime   20 x 10e6 pulses
Beam dimension  10 x 20 ㎟
Beam divergence   3 x 10 mrad
Laser tube lifetime   1 I 109 pulses
Cooling    Water

- Amorphous silicon annealing system by excimer laser

- Amorphous silicon is changed to polycrystalline sillicon after melting in a moment during being irradiated by XeCl excimer laser.

- TFT LCD annealing process


Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

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