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  • Tape Full Auto Lamination For Cell
    KSEM

    KSEM

    Tape Full Auto Lamination For Cell
    Model
    ALM-100
    Series
    Lamination

    Product Description

    Overview

     

    Basic Information

    Model name : ALM-100 It is an equipment that automatically laminates the tape on the cell type substrate supplied in the boat.

     

    Features

    High Production : Dual lamination head

    Output : UPH 120ea

    Protect film auto peel out

    Protect film supply stacker : dual

    Conversion-less Size change of vision align

    High lamination accuracy : +/- 50um 

    No bubble lamination rolling : roll tilt & pressure control

     

     

    Specifications

     

    Main Specs

    UPH Min 120ea
    Lamination Head Dual
    Lamination Accuracy XY : ±50um
    Load Magazine stack 6 magazine
    Unload Magazine stack 6 magazine
    Lamination film peel out Auto
    Lamination stacker Dual
    Lamination film supply Auto
    Cell Size 50-100mm
    Boat Size Length : 310mm
    Width : 140mm
    Thickness : 9mm
    Magazine Size Length: 311 mm
    Width: 146 mm
    Thickness: 94 mm
    Slot : 5ea
    Power requirements Power supply : AC 220 V 30 A
    Dry air 0.5 MPa (60 L/min)
    Vacuum -80 KPa (100 L/min)
    Dimensions (W) 1,720 × (D) 1,200 × (H) 1,920 mm
    (Include FFU)
    Weight Approximately 1,000 kg

     

    Options

    Optional Functions Safety door
    Light curtain
    Ionizer blower
    ESD > 50VDC
     

    Product List

    Die Bonder

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    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100