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  • High performance FO-PLP BONDER
    KSEM

    KSEM

    High performance FO-PLP BONDER
    Model
    AD-400
    Series
    Die Bonder

    Product Description

    Overview

     

    Basic Information

    Model name : AD-400

    As the production of Fan-out Panel Level Packages increases, the purpose of increasing I/O density and production yield Precise Bonding Accuracy and UPH Improvement, Customized Pick and Placement for Each Customer Equipment development required

     

    Features

    1. High productivity : UPH 15K

    2. Applied panel size : 615x625mm

    3. High placement accuracy : Local ±8㎛@3σ  / Global ±15㎛@3σ 

    4. Temprature : Bond head 150°C / Bond stage 150°C

    5. Face up & Face down

    6. Auto tool change : Bond, Pickup tool

    7. Multi ejector system

    8. Auto panel load_unload system

    9. Wafer auto change system

    10 .100class cleanness of FFU

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100