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  • High-accuracy  & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    KSEM

    KSEM

    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    Model
    AD-300
    Series
    Die Bonder

    Product Description

    Overview

     

    Basic Information

    Model name : AD-300

    High-accuracy  & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.

     

    Features

    1. High productivity : UPH 7K (B’g time 0.5s , dual two in one concept)

    2. Single lane(standard) , Dual lane(option) : Bin 1 & Bin 2 division bonding

    3. High placement accuracy : ±10㎛@3σ 

    4. Thin die bonding technology

        Patented slide ejector

        Multi step ejector compatible

        Min thickness 20㎛

    5. 100class cleanness of FFU 

    6. Auto device change

        Auto tool change : Bond, Pickup tool     Ultra thin die thickness : Min 20㎛

    7. OHT automation

    8. Wafer auto change system

     

     

    Specifications

     

    Main Specs

    Bonding Method Epoxy bonding / DAF Tape
    Bonding Speed 0.5sec/cycle
    Bonding Accuracy XY : ±10μm,3σ
    θ : ±0.05°,3σ
    Die Size  Ø5.0-25.0mm t=30μm-
    Substrate Size Length : 100–300 mm
    Width : 30–102 mm
    Magazine Size Length : 100–315 mm
    Width : 30–115 mm
    Thickness : 50–200 mm
    Wafer Size Max 12 inch
    Power requirements Power supply : AC 220 V 30 A
    Dry air  0.5 MPa (60 L/min)
    Vacuum -80 KPa (100 L/min)
    Dimensions (W) 2,160 × (D) 1,470 × (H) 1,600 mm
    Weight Approximately 2,500 kg

     

    Options

    Optional Functions Dual lane
    Ionizer blower
    Needleless pickup unit
    Wafer mapping
    Secs & gem
    FFU / ATC / OHT

     

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100