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  • High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    KSEM

    KSEM

    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    Model
    AD-200
    Series
    Die Bonder

    Product Description

    Overview

     

    Basic Information

    Model name : AD-200

    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.

     

    Features

    1.High quality / High productivity  : two in one concept.

        Use of intermediate stage ensures high quality and high productivity.

    2.Best Quality of Patented paste controller(syringe 5cc, 10cc, option 30cc~).

    3.Applied Force Control of Air Actuator.

    4.Applied High Speed linear motor system.

    5.Real time pre/post Inspection System   6.High-accuracy small die pickup     Min 0.2mm compatibility.

    7.Thin die bonding technology

        Patented slide ejector

        Multi step ejector compatible

        Min thickness 20㎛

    8. 100class cleanness of FFU

    9. Wafer auto change system

     

     

    Specifications

     

    Main Specs

    Bonding Method Epoxy bonding / DAF Tape
    Bonding Speed 0.35sec/cycle
    Bonding Accuracy Epoxy : XY ± 20 μm , 3σ
    DAF : XY ± 10 μm , 3σ
    Bonding Force  0.5~30N(Option 50N)
    Lead frame Size Length : 100–300 mm
    Width : 30–102 mm
    Thickness : 0.075–2.0 mm
    Magazine Size Length : 100–315 mm
    Width : 30–115 mm
    Thickness : 50–200 mm
    Wafer Size 8/12 inch
    Power requirements Power supply : AC 220 V 30 A
    Dry air  0.4 MPa (60 L/min)
    Vacuum -70KPa (100 L/min)
    Dimensions (W) 1,930 × (D) 1,400 × (H) 1,600 mm
    Weight Approximately 2,000 kg

     

    Options

    Optional Functions Two in one die stage unit
    Magazine stacker loader
    Needleless pickup unit
    Polishing cover
    Wafer mapping
    SECS & GEM
    FFU

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100