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High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI

Model

Series

Die Bonder


Transaction Process

Please contact Komachine.

Payment

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Delivery

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Shipment

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Origin

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Description

Overview

 

Basic Information

Model name : AD-100

High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI

 

Features

1.Small footprint.

2.Best Quality of Patented controller(syringe 5cc, 10cc, option 30cc~). 

3.Flexible Wide range of lead frame compatibility    Lead frame size: W 102 mm × L 300 mm.

4.Single or twin dispensing system    Compatible with a variety of pastes, stable application performance.

5.High-accuracy small die pickup    Φ0.15–8.0 mm compatibility.

6. Wafer auto change system

 

 

Specifications

 

Main Specs

Main Specs Epoxy bonding
Bonding Speed 0.18sec/cycle
Bonding Accuracy XY : ±25μm,3σ
θ : ±1°,3σ(Φ1.0mm or above)
θ : ±3°,3σ(under Φ1.0mm)
Die Size Ø0.2-Φ8.0mm t=0.1-0.5mm
Option : Φ0.15-Ø2.0mm
Lead frame Size Length : 50-260mm(up to 300 mm in option)
Width : 30-102mm
Thickness : 0.1-1.5mm
Magazine Size Length : 50-260mm(up to 300 mm in option)
Width : 30-110mm
Thickness : 50-200mm
Wafer Size Max Ø8 inch
Power requirements Power supply: AC 220 V / 30 A
Dry air: 0.4 MPa (60 L/min)
Vacuum: -70 KPa (100 L/min)
Dimensions (W) 1,650 × (D) 1,200 × (H) 1,500mm
Weight Approximately 1,500 kg

 

Options

Optional Functions Magazine stacker loader
Twin dispenser
Ionizer blower
Substrate height laser sensor
Wafer mapping
FFU

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

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