Chat with us, powered by LiveChat High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI | KSEM - Komachine
Product Name High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
Model AD-100
Series Die Bonder
Catalog
Product Description


Basic Information

Model name : AD-100

High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI



Features

1.Small footprint.

2.Best Quality of Patented controller(syringe 5cc, 10cc, option 30cc~). 

3.Flexible Wide range of lead frame compatibility   Lead frame size: W 102 mm × L 300 mm.

4.Single or twin dispensing system   Compatible with a variety of pastes, stable application performance.

5.High-accuracy small die pickup   Φ0.15–8.0 mm compatibility.

6. Wafer auto change system


Main Specs

Main SpecsEpoxy bonding
Bonding Speed0.18sec/cycle
Bonding Accuracy
XY : ±25μm,3σ
θ : ±1°,3σ(Φ1.0mm or above)
θ : ±3°,3σ(under Φ1.0mm)
Die Size
Ø0.2-Φ8.0mm t=0.1-0.5mm
Option : Φ0.15-Ø2.0mm
Lead frame Size
Length : 50-260mm(up to 300 mm in option)
Width : 30-102mm
Thickness : 0.1-1.5mm
Magazine Size
Length : 50-260mm(up to 300 mm in option)
Width : 30-110mm
Thickness : 50-200mm
Wafer Size
Max Ø8 inch
Power requirements
Power supply: AC 220 V / 30 A
Dry air: 0.4 MPa (60 L/min)
Vacuum: -70 KPa (100 L/min)
Dimensions
(W) 1,650 × (D) 1,200 × (H) 1,500mm
Weight
Approximately 1,500 kg



Options

Optional FunctionsMagazine stacker loader
Twin dispenser
Ionizer blower
Substrate height laser sensor
Wafer mapping
FFU



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