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  • High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    KSEM

    KSEM

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    Model
    AD-100
    Series
    Die Bonder

    Product Description

    Overview

     

    Basic Information

    Model name : AD-100

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI

     

    Features

    1.Small footprint.

    2.Best Quality of Patented controller(syringe 5cc, 10cc, option 30cc~). 

    3.Flexible Wide range of lead frame compatibility    Lead frame size: W 102 mm × L 300 mm.

    4.Single or twin dispensing system    Compatible with a variety of pastes, stable application performance.

    5.High-accuracy small die pickup    Φ0.15–8.0 mm compatibility.

    6. Wafer auto change system

     

     

    Specifications

     

    Main Specs

    Main Specs Epoxy bonding
    Bonding Speed 0.18sec/cycle
    Bonding Accuracy XY : ±25μm,3σ
    θ : ±1°,3σ(Φ1.0mm or above)
    θ : ±3°,3σ(under Φ1.0mm)
    Die Size Ø0.2-Φ8.0mm t=0.1-0.5mm
    Option : Φ0.15-Ø2.0mm
    Lead frame Size Length : 50-260mm(up to 300 mm in option)
    Width : 30-102mm
    Thickness : 0.1-1.5mm
    Magazine Size Length : 50-260mm(up to 300 mm in option)
    Width : 30-110mm
    Thickness : 50-200mm
    Wafer Size Max Ø8 inch
    Power requirements Power supply: AC 220 V / 30 A
    Dry air: 0.4 MPa (60 L/min)
    Vacuum: -70 KPa (100 L/min)
    Dimensions (W) 1,650 × (D) 1,200 × (H) 1,500mm
    Weight Approximately 1,500 kg

     

    Options

    Optional Functions Magazine stacker loader
    Twin dispenser
    Ionizer blower
    Substrate height laser sensor
    Wafer mapping
    FFU

    Product List

    Die Bonder

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Lamination

    Tape Full Auto Lamination For Cell
    ALM-100