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Series2

Die Bonder

Lamination

Product List

5

High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI

AD-100

High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.

AD-200

High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.

AD-300

High performance FO-PLP BONDER

AD-400

Tape Full Auto Lamination For Cell

ALM-100

1

VIP

Partners

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KSEM

KSEM

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.