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Korea Vacuum Tech

Korea Vacuum Tech

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Model

Series

Etcher


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

Overview

Ion-Beam etching is a versatile process for pattern delineation and material modification.

The low pressure, line-of-sight nature of beam techniques provides a flexibility of

directional bombardment not available in other plasma processes. The ability to etch

virtually any material by the sputtering process opens a wide variety of diverse

applications.

 

Features

≻ High selectivity, uniform plasma

≻ Simple configuration makes maintenance easy

≻ The physical and chemical etching systems are controlled independently

≻ Low damage & contamination

≻ Physical etching using Ar Ion-Beam distributes reactive gases such as Cl2, He, BCl3 evenly around substrate.


System configuration

Substrate size

2” - 6” (50.8mm - 150mm)

Operating pressure (Torr)

> 1.0E-4 Torr

Uniformity within substrate /

substrate to substrate surfaces

± 5% max.

Ion source

3cm ~ 20scm (@1” ~ 8”)

Tilt / Rotation / Cooling

Ultimate Pressure


Korea Vacuum Tech  Ion Milling Series

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  535-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

ⓒ2022 Komachine Co. All rights reserved.