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Product Name
Model KVP-2000 Seires
Series PLD
Catalog
Product Description

Korea Vacuum Tech  KVP-2000 Seires

Overview

PLD (Pulsed Laser Deposition) is a physical deposition method that utilizes a high energy

focused laser. Conceptually and experimentally. PLD is extremely simple. It consists of a

target holder and a substrate holder housed in a vacuum chamber. A set of optical

components focus and raster a high-power laser (the external source) into a

concentrated beam over the target surface which vaporizes target materials to

ultimately deposite thin film.

 

Advantages

≻ Allows for the use of various targets and for the in-situ deposition of multi-layers

≻ Consists of simple hardware

≻ Simple system maintenance

≻ Various aspect of beam-target-substrate positioning

≻ Temperature uniformity of substrate

≻ Pyrometer Port

≻ Laser strength measurement port

≻ Ellipsometry port

Specifications

ITEM

SPECIFICATIOINS

UHV chamber Ultimate Pressure

up to 5.0E-9Torr

Two Chamber System

Process chamber & Loadlock chamber

Uniformity Zone of Substrate Heating

Ø15 mm

Substrate Temperature

850°C ± 5°C in oxygen

Operating Pressure

0.01mTor ~ 10 Torr

Target Carousel

one inch (25.4mm) diameter for four targets

Normal Angle of Incidence

Laser beam on target : 45° with respect to target normal

Loading type

Easy to load or unload sample and target by magnetic transfer

Option1

RHEED (Reflection High-Energy Electron Diffraction)

Option2

CCD Camera for Oscillation of RHEED

Option3

Pyrometer for measuring substrate temperature

Korea Vacuum Tech  KVP-2000 Seires 1

Korea Vacuum Tech  KVP-2000 Seires 2

Overview

PLD (Pulsed Laser Deposition) is a physical deposition method that utilizes a high energy

focused laser. Conceptually and experimentally. PLD is extremely simple. It consists of a

target holder and a substrate holder housed in a vacuum chamber. A set of optical

components focus and raster a high-power laser (the external source) into a

concentrated beam over the target surface which vaporizes target materials to

ultimately deposite thin film.

 

Advantages

≻ Allows for the use of various targets and for the in-situ deposition of multi-layers

≻ Consists of simple hardware

≻ Simple system maintenance

≻ Various aspect of beam-target-substrate positioning

≻ Temperature uniformity of substrate

≻ Pyrometer Port

≻ Laser strength measurement port

≻ Ellipsometry port

Specifications

ITEM

SPECIFICATIONS

Uniformity Zone of Substrate Heating

Ø15 mm

Substrate Temperature

850°C ± 5°C in oxygen

Operating Pressure

0.01 mTorr ~ 10 Torr

Target Carousel

one inch (25.4mm) diameter for four targets

Normal Angle of Incidence

 

Laser beam on target : 45° with respect to target normal

Operational Wavelength

248 nm (KrF)

Base Pressure

2.0E-7 Torr using turbo molecular pump

Korea Vacuum Tech  KVP-2000 Seires 3

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