Kohyoung Technology Inc.
Kohyoung Technology Inc.
Description
World-Best Advanced IC Packaging Inspection
· The world's most advanced IC packaging process optimization solution
- Industry leading measurement accuracy and inspection reliability
- Provides high-resolution review
- Applicable packaging: SiP, 2.5D, 3D, 3D WLP, WL CSP, FO WLP, FC BGA, MCM
- Handling media: Laminate Substrate, Metal Carrier, Strip on Boat, Mylar Frame
· Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Real-time process optimization through powerful SPC analytics
- Efficient process management through convenient software
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.