Daesung Engineering
Daesung Engineering
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Description
EMI Shield Vacuum Laminator
EMI 차폐용 Tape Lamination을 기존 Ball 도피 방식에서 Vacuum Lamination 방식으로 개발하여 공정 개선함.
EMI Shield Vacuum Laminator
| List | SPECIFICATIONS | |
|---|---|---|
| Type | VACUUM LAMINATOR for EMI Shield Spray | |
| Application |
Tape Lamination at Bump without Void by expanding Diaphragm at the condition of mounted Chip Bump |
|
| Machine size | 21265[W] X 970[D] X 2020[H] | |
| Material |
380 X 380 RING FRAME |
|
| UPH[Unit Per Hour] | about 60 FRAME/Hr | |
| Purity | Class 1000 | |
| Loading / Unloading | Inline possible with using Conveyor system | |
| Vacuum | Within 1 Torr | |
| DIAPHRAGM PRESS | Max. 0.12 Mpa | |
| DIAPHRAGM HEATING | about 120 degree | |
| WORK MOVING TYPE | PICK & PLACE type applied by using vacuuming Ejector | |
| Contorol method | PLC control | |
| POWER SUPPLY | 3PHASE 220V, 60HZ, 50A over | |
| AIR | 0.5 ~ 0.6 Mpa,ø10 | |
| PCW | Vacuum Pump | |
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.