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Daesung Engineering

Daesung Engineering

Daesung Engineering

Daesung Engineering

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Daesung Engineering

Daesung Engineering

Auto BG Laminator

Model

Series

Semiconductor


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Description

Auto BG Laminator

The system is for laminating protection tape to the side of wafer pattern before Wafer Back Grinding Processing.

Product descriptions

 Daesung Engineering Auto BG Laminator
 

SPECIFICATION

· TYPE : FULL AUTO THIN 
· WAFER SIZE(inch) : 6”, 8”, 12”
· DEMENSION(mm) : 1,520(W) * 1,400(D) * 1,900(H)
· WEIGHT : 800kg  
 
 

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

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