Daesung Engineering
Daesung Engineering
Description
UV Irradiator
This System is for removing wafer tape’s adhesive after cutting the Wafer in semiconductor package assembly process and uses the LED module as source of U.V light to increase of irradiation uniformity.
Product descriptions
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.