DAEOUNG MACHINERY
DAEOUNG MACHINERY
Description
Processing equipment needed for the process through which sapphire ingot important for LED production is made with wafers.
- Tool : Diamond O.D Saw
- Top & Tail Cutting : Cuts both ends of sapphire ingot
- Sample Cutting : Cuts sample of 1~2mm thick
- High-speed and stable cutting and processing
Top & Tail Cutting
- Tool : Diamond Cup Wheel
- O.D Grinding : Grinding of the cylindrical side of sapphire ingot with top & tail cut at the desired size
- Flat Grinding : Grinds a right-angle side on the axis A at the desired side
- High-speed, high-precision and auto grinding process
OD & Flat Grinding
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.