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Dry Film Auto Peeler (Horizontal)

Model

Series

COMS


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Description

It peels the Mylar Film horizontally during Dry Film for circuit process after exposuring.


Standard Type
It is applicable to super thin plate, and picking up the substrate from the flat table and peeling a side by taping and then unload the substrate.

Compact Type
It is applicable to thin plate product handling and it is small sized equipment for space constraint company.

Specification

ItemsStandard TypeCompact Type
Work Size510mm × 610mm / 405mm × 510mm 405(~415)mm × 510mm
Work Thickness0.04mm ~ 1.2mm0.04mm ~ 1.2mm
Tact Time13sec (Customize)16sec (Customize)
FootprintMain MC : 2,350(L) × 1,250(W) × 1,850(H)
Box Loader (additional) : 1,400(L) × 1,250(W) × 1,850(H)
Main MC : 1,850(L) × 1,250(W) × 1,850(H)
Box Loader (additional) : 1,400(L) × 1,250(W) × 1,850(H)
StructureMain Auto Peeler MC
In Line or Loading System
Main Auto Peeler MC
In Line or Loading System
Loading Unloading 
(Customize & Option)
In Line to DES or N.C Developing MC
Loading MC to DES or N.C Developing MC
In Line to DES or N.C Developing MC
Loading MC to DES or N.C Developing MC
Applications.Package Substrate, HDI DF ProcessPackage Substrate, HDI DF Process

※It is subject to change without any notice for better quality, and a customizable equipment.

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.