CO-MS, The Republic of Korea - Komachine Supplier Profile and Product List

- CO-MS Co., Ltd. is a specialized company in developing and producing cutting-edge automation equipment for various industrial sectors, including PCB, semiconductor, mobile camera modules, displays, and MLCC. The company is committed to Customer Oriented Manufacturing Solutions, demonstrating top-tier technical competence and extensive development know-how in highly complex automation fields. Its operational philosophy focuses on quality improvement, cost reduction, and achieving zero customer complaints.CO-MS Co., Ltd. is a specialized company in developing and producing cutting-edge automation equipment for various industrial sectors, including PCB, semiconductor, mobile camera modules, displays, and MLCC. The company is committed to Customer Oriented Manufacturing Solutions, demonstrating top-tier technical competence and extensive development know-how in highly complex automation fields. Its operational philosophy focuses on quality improvement, cost reduction, and achieving zero customer complaints.
- Dry Film Auto Peeler (models: APH-5060S,C): Automation equipment for precise peeling/attaching protective films in PCB and semiconductor package substrate manufacturing processes. Both horizontal and vertical (DFSR/ABF Auto Peeler) models are available.Dry Film Auto Peeler (models: APH-5060S,C): Automation equipment for precise peeling/attaching protective films in PCB and semiconductor package substrate manufacturing processes. Both horizontal and vertical (DFSR/ABF Auto Peeler) models are available.
- MLCC Packing Auto Remove Machine (model: MLS - 2020): Equipment for automatic removal of packaging for MLCC (Multi-Layer Ceramic Capacitor) products. Incorporates magnetic field detection technology for MLCC stacking surface detection.MLCC Packing Auto Remove Machine (model: MLS - 2020): Equipment for automatic removal of packaging for MLCC (Multi-Layer Ceramic Capacitor) products. Incorporates magnetic field detection technology for MLCC stacking surface detection.
- Lens Cutting Machine (model: LCS - 24): Precision cutting equipment for mobile camera lenses, featuring 24Cavity high-speed lens cutting technology.Lens Cutting Machine (model: LCS - 24): Precision cutting equipment for mobile camera lenses, featuring 24Cavity high-speed lens cutting technology.
- Electric Checker Handler (GATS Series): Various types of electrical inspection equipment, including BBT (Bare Board Tester) and COF Tester, for checking the electrical characteristics of PCB substrates.Electric Checker Handler (GATS Series): Various types of electrical inspection equipment, including BBT (Bare Board Tester) and COF Tester, for checking the electrical characteristics of PCB substrates.
- Die Attach Machine and SSD Packing Process MC: Semiconductor post-processing equipment, including Die and Film Attach facilities, and inspection/automatic packaging facilities for memory and SSDs, covering the entire semiconductor post-processing automation lineup.Die Attach Machine and SSD Packing Process MC: Semiconductor post-processing equipment, including Die and Film Attach facilities, and inspection/automatic packaging facilities for memory and SSDs, covering the entire semiconductor post-processing automation lineup.
- Waterjet Laser Dicing Equipment: Provides next-generation laser dicing solutions that minimize wafer damage through precise cutting.Waterjet Laser Dicing Equipment: Provides next-generation laser dicing solutions that minimize wafer damage through precise cutting.
- Cover Glass Auto Inspection Machine: High-precision equipment for manufacturing next-generation displays and smartphone core components, including cover glass inspection machines.Cover Glass Auto Inspection Machine: High-precision equipment for manufacturing next-generation displays and smartphone core components, including cover glass inspection machines.
- Autonomous Logistics Robots and Medical I.V. Catheter Automatic Assembly Line: Autonomous logistics robots developed as part of smart factory solutions, and automation facilities for the medical sector, such as I.V. catheter assembly lines.Autonomous Logistics Robots and Medical I.V. Catheter Automatic Assembly Line: Autonomous logistics robots developed as part of smart factory solutions, and automation facilities for the medical sector, such as I.V. catheter assembly lines.
- Customized Manufacturing Solution Capabilities: Possesses advanced complex automation technology specialized in custom design, manufacturing, and programming to meet diverse customer requirements.Customized Manufacturing Solution Capabilities: Possesses advanced complex automation technology specialized in custom design, manufacturing, and programming to meet diverse customer requirements.
- Unique PCB Film Peeling Technology: Holds world-leading and world's first dedicated sensor technology for PCB film peeling detection. Patented technology related to ultra-thin handling (Peeling&Detach).Unique PCB Film Peeling Technology: Holds world-leading and world's first dedicated sensor technology for PCB film peeling detection. Patented technology related to ultra-thin handling (Peeling&Detach).
- Ultra-precision Automation and Inspection Technology: Specializes in manufacturing top-tier automation facilities and semiconductor equipment based on ultra-precision motion control, robot operation, vision technology, and precision machining. Possesses unique automated inspection technology to address the miniaturization of semiconductor processes.Ultra-precision Automation and Inspection Technology: Specializes in manufacturing top-tier automation facilities and semiconductor equipment based on ultra-precision motion control, robot operation, vision technology, and precision machining. Possesses unique automated inspection technology to address the miniaturization of semiconductor processes.
- Turnkey Solutions and Stable Mass Production System: Offers turnkey solution capabilities covering the entire process from design to commissioning for semiconductor post-processing automation equipment. Established a stable mass production system for ultra-precision equipment through its 1,939-pyeong Asan 2nd Plant and high-purity cleanrooms.Turnkey Solutions and Stable Mass Production System: Offers turnkey solution capabilities covering the entire process from design to commissioning for semiconductor post-processing automation equipment. Established a stable mass production system for ultra-precision equipment through its 1,939-pyeong Asan 2nd Plant and high-purity cleanrooms.
- Continuous R&D and Patent Acquisition: Secured over 45 patents through its in-house R&D center over 16 years, continuously expanding its technology portfolio. Holds intellectual property rights for core technologies such as the world's first domestic and international patent for Mylar Detection Sensor.Continuous R&D and Patent Acquisition: Secured over 45 patents through its in-house R&D center over 16 years, continuously expanding its technology portfolio. Holds intellectual property rights for core technologies such as the world's first domestic and international patent for Mylar Detection Sensor.
- Global Market Expansion and Localization Strategy: Established CO-MS VINA in Vietnam for close customer support and expanded exports to various regions including China, Japan, Vietnam, Taiwan, and the United States.Global Market Expansion and Localization Strategy: Established CO-MS VINA in Vietnam for close customer support and expanded exports to various regions including China, Japan, Vietnam, Taiwan, and the United States.
- PCB (Printed Circuit Board) Industry: Film peeling/attaching equipment, electrical characteristic inspection equipment (BBT), laser marking equipment.PCB (Printed Circuit Board) Industry: Film peeling/attaching equipment, electrical characteristic inspection equipment (BBT), laser marking equipment.
- Semiconductor Industry: Semiconductor package substrate manufacturing processes, semiconductor post-processing equipment (Die Attach, SSD Packing), wafer dicing equipment.Semiconductor Industry: Semiconductor package substrate manufacturing processes, semiconductor post-processing equipment (Die Attach, SSD Packing), wafer dicing equipment.
- Mobile Camera Module Industry: Camera module inspection and assembly equipment, lens cutting equipment, VCM manufacturing process automation facilities.Mobile Camera Module Industry: Camera module inspection and assembly equipment, lens cutting equipment, VCM manufacturing process automation facilities.
- Display Industry: High-precision equipment for manufacturing next-generation displays and smartphone core components, cover glass inspection machines.Display Industry: High-precision equipment for manufacturing next-generation displays and smartphone core components, cover glass inspection machines.
- MLCC (Multi-Layer Ceramic Capacitor) Industry: MLCC Packing Auto Remove Machine and related solutions.MLCC (Multi-Layer Ceramic Capacitor) Industry: MLCC Packing Auto Remove Machine and related solutions.
- Secondary Cell Industry: Membrane Film Trimming Rewinder, Cell tracking systems.Secondary Cell Industry: Membrane Film Trimming Rewinder, Cell tracking systems.
- Medical/Care Robot Industry: Care robots for the socially vulnerable, medical I.V. catheter automatic assembly lines.Medical/Care Robot Industry: Care robots for the socially vulnerable, medical I.V. catheter automatic assembly lines.
- China, Japan, Vietnam, TaiwanChina, Japan, Vietnam, Taiwan
- United StatesUnited States
- Patents: Holds 66 patents as of November 2025. Key patents include 'Automatic Peeling Machine and Film Peeling Method for Semiconductor Printed Circuit Boards', 'MLCC Laser Application Technology Patent (Flexible Compression Film Laser Cutting Device)', 'Utility Model for Camera Modules (related to Mobile Camera Lens)', 'World's First Domestic and International Patent for Mylar Detection Sensor (PCB Plate Film Monitoring System)', and 'Patent related to Ultra-thin Handling (Peeling&Detach)'.Patents: Holds 66 patents as of November 2025. Key patents include 'Automatic Peeling Machine and Film Peeling Method for Semiconductor Printed Circuit Boards', 'MLCC Laser Application Technology Patent (Flexible Compression Film Laser Cutting Device)', 'Utility Model for Camera Modules (related to Mobile Camera Lens)', 'World's First Domestic and International Patent for Mylar Detection Sensor (PCB Plate Film Monitoring System)', and 'Patent related to Ultra-thin Handling (Peeling&Detach)'.
- Certifications: Registered as a venture company in 2006. Acquired ISO 9001 and ISO 14001 certifications in 2009. Designated as a Global Hidden Champion by the Ministry of SMEs and Startups in 2019 and 2023. Selected as one of the 'Innovation Companies National Representative 1000' in 2021. Selected as a Regional Innovation Leading Company in Chungbuk in 2022.Certifications: Registered as a venture company in 2006. Acquired ISO 9001 and ISO 14001 certifications in 2009. Designated as a Global Hidden Champion by the Ministry of SMEs and Startups in 2019 and 2023. Selected as one of the 'Innovation Companies National Representative 1000' in 2021. Selected as a Regional Innovation Leading Company in Chungbuk in 2022.
- Awards: Awarded the '1 Million Dollar Export Tower' on Trade Day in 2016, with CEO Hwang Sun-oh receiving the Dongtap Industrial Medal. Received the '5 Million Dollar Export Tower' in 2018. Awarded the '10 Million Dollar Export Tower', 'SME Grand Prize', and 'Excellent Job Creation Company' certification in 2020. Received the '20 Million Dollar Export Tower' in 2022.Awards: Awarded the '1 Million Dollar Export Tower' on Trade Day in 2016, with CEO Hwang Sun-oh receiving the Dongtap Industrial Medal. Received the '5 Million Dollar Export Tower' in 2018. Awarded the '10 Million Dollar Export Tower', 'SME Grand Prize', and 'Excellent Job Creation Company' certification in 2020. Received the '20 Million Dollar Export Tower' in 2022.