ATI, Advanced Technology
Packaging Inspection System
Model
Series
Semiconductor
Transaction Process
Please contact the manufacturer/supplier.
Payment
Contact the manufacturer/supplier.
Delivery
Contact the manufacturer/supplier.
Shipment
Contact the manufacturer/supplier.
Origin
Contact the manufacturer/supplier.
Description
▪ 2D inspection with good resolution
▪ 3D height measurement of the attached components
▪ Multiple handling of various types of packaging
- JEDEC tray, SUS tray, strip, etc.
▪ IR optics for inspection through silicon
* Optional stage heating
▪ IR Inspection
▪ BLT Measurement