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  • ATI, Advanced Technology

    Packaging Inspection System
    Model
    CYPRESS
    Series
    Semiconductor

    Product Description

    Die attach Inspection 

    ▪ 2D inspection with good resolution

    ▪ 3D height measurement of the attached components

    ▪ Multiple handling of various types of packaging 
        - JEDEC tray, SUS tray, strip, etc.

    ▪ IR optics for inspection through silicon 

     * Optional stage heating


    ▪ IR Inspection

    ATI, Advanced Technology Packaging Inspection System CYPRESS

     

    ▪ BLT Measurement

    ATI, Advanced Technology Packaging Inspection System CYPRESS 1

    Product List

    Semiconductor

    Wafer Inspection System
    WIND
    Auto Scope System
    OAK
    CIS Inspection System
    ACIS-1200 Series
    Reticle Macro AFVI
    SUN
    Packaging Inspection System
    CYPRESS

    LED

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    AVIS-5000P
    LED Chip AFVI
    AVIS-5000C

    PCB

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    AVIS-1800 Series
    HDI PCB AFVI
    AVIS-3600 Series
    IC Package Substrate Sorting System
    ASIS-1000C

    Laser Application

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    LMS Series
    Fiber Laser Cutting System
    ALC-100
    UV Laser Micro Machining System
    ULC-100

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