ATI, Advanced Technology
ATI, Advanced Technology
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Packaging Inspection System
Model
Series
Semiconductor
Transaction Process
Please contact the manufacturer/supplier.
Payment
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Delivery
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Shipment
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Origin
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Description
Die attach Inspection
▪ 2D inspection with good resolution
▪ 3D height measurement of the attached components
▪ Multiple handling of various types of packaging
- JEDEC tray, SUS tray, strip, etc.
▪ IR optics for inspection through silicon
* Optional stage heating
▪ IR Inspection
▪ BLT Measurement
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.